• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, April 12, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » CHIPS Act to Fund $325M Expansion at Hemlock Semi for Polysilicon

CHIPS Act to Fund $325M Expansion at Hemlock Semi for Polysilicon

October 23, 2024
in Semiconductors
A A

The U.S. Department of Commerce reached a preliminary agreement with Hemlock Semiconductor (HSC) to boost the domestic production of semiconductor-grade polysilicon. This non-binding memorandum details a proposed $325 million investment, facilitated by the CHIPS and Science Act, to enhance HSC’s production capacity at its Michigan facility. The initiative is designed to support the U.S. semiconductor industry by providing hyper-pure polysilicon, which is an essential component for chip manufacturing. Furthermore, the project anticipates the creation of approximately 180 permanent manufacturing positions and over 1,000 construction jobs.

HSC, the only U.S.-based producer of hyper-pure polysilicon, is one of just five companies globally that meet the purity standards required for high-end semiconductor applications. This expansion will increase the company’s capacity to supply materials essential for microprocessors, AI chips, and other advanced devices. The Biden Administration’s CHIPS Act aims to strengthen the U.S. semiconductor supply chain and reduce reliance on foreign imports, enhancing both national and economic security.

The proposed investment also supports HSC’s collaboration with local institutions to provide semiconductor training and employment opportunities. Additionally, HSC is participating in Michigan’s Tri-Share initiative to make child care more affordable for its employees. According to HSC CEO AB Ghosh, “This investment highlights our commitment to remaining a top polysilicon supplier while helping to secure America’s technological and energy future.”

Key Points:

• $325 million proposed CHIPS Act investment for HSC expansion.

• 180 permanent jobs and 1,000 construction jobs expected.

• HSC is the sole U.S. producer of hyper-pure polysilicon for semiconductors.

• Collaboration with local colleges and child care affordability programs included.

Tags: CHIPs Act
ShareTweetShare
Previous Post

BT Activates First Mobile Site with Renewable Energy

Next Post

T-Mobile Q3 2024: 6 Million Broadband Customers, Raises 2024 Guidance

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics
Semiconductors

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics

September 25, 2025
Natcast Leads U.S. National Semiconductor Technology Center with $6.3B Funding
Semiconductors

Natcast Leads U.S. National Semiconductor Technology Center with $6.3B Funding

January 16, 2025
U.S. advances plan for national semiconductor research facilities
Semiconductors

U.S. Department of Commerce Allocates $1.4 Billion for Advanced Semiconductor Packaging

January 16, 2025
CHIPS for America allocates $3 billion for National Advanced Packaging
Semiconductors

Four More Companies Land $264M in CHIPs Act Funding

January 16, 2025
MACOM posts revenue of $178.1 million, up 14.8% yoy
Semiconductors

MACOM Unveils $345M Plan to Modernize Semiconductor Facilities

January 14, 2025
U.S. advances plan for national semiconductor research facilities
All

Amkor Secures $407M CHIPS Grant for Advanced Packaging

December 26, 2024
Next Post
T-Mobile US hits 1 Gbps upload with 5G carrier aggregation

T-Mobile Q3 2024: 6 Million Broadband Customers, Raises 2024 Guidance

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version