Lightmatter and Amkor Technology have partnered to develop what the companies say is the world’s largest 3D-packaged photonics chip complex, powered by Lightmatter’s Passage platform. The collaboration brings together Lightmatter’s 3D-stacked photonic interconnect and Amkor’s expertise in multi-die semiconductor packagingThe work addresses the rising power and interconnect demands of AI workloads, which have outgrown traditional chip scaling approaches. The partnership’s first implementation will debut at SC24 in Atlanta.
As AI processors grow larger and consume more power, integrating multiple silicon dies in a single package becomes critical. Existing electrical interposer methods are limited by the physical “shoreline” for memory and I/O chiplets, constraining bandwidth. Lightmatter’s Passage platform eliminates this bottleneck by using 3D-stacked photonic interconnects with optical I/O across the entire chip area. Combined with Optical Circuit Switching (OCS), Passage provides superior bandwidth, resiliency, and flexibility, creating a robust solution for next-generation AI and high-performance computing (HPC).
The two companies will deliver a scalable multi-reticle die complex on an organic substrate using a 3D package design. The approach not only enables unprecedented silicon density and bandwidth but also optimizes energy efficiency to meet the doubling power demands of AI processors. “We are thrilled to collaborate with Lightmatter to bring this groundbreaking silicon photonics technology to the mainstream,” said Kevin Engel, EVP of Business Units at Amkor Technology.
Key Points:
• Lightmatter and Amkor develop the largest 3D-packaged photonics chip, using the Passage™ platform.
• Passage integrates photonic interconnects and Optical Circuit Switching (OCS) for high bandwidth and resilience.
• The solution addresses the bandwidth and power challenges of scaling AI processors.
• Debut set for SC24 in Atlanta, showcasing multi-reticle die complex with a 3D package.
• Collaborative effort bridges photonics and advanced semiconductor packaging.
“We are delighted to partner with Amkor on a 3D photonics solution that pushes both the boundaries of advanced packaging as well as silicon performance,” said Ritesh Jain, SVP of Engineering and Operations at Lightmatter. “This collaboration is a pivotal step in building a world-class ecosystem that empowers our customers to realize AI and HPC compute offerings with unprecedented bandwidth and efficiency.”
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider.
