Flex announced the acquisition of JetCool Technologies, a liquid cooling company specializing in solutions for data centers and high-performance computing. The move expands Flex’s capabilities in addressing power, heat, and scalability challenges as hyperscale and enterprise customers ramp up deployments for AI workloads. The deal builds on their existing partnership from the 2024 OCP Global Summit, combining JetCool’s microconvective liquid cooling technology with Flex’s manufacturing and data center infrastructure expertise.
Founded in 2019 and headquartered in Littleton, Massachusetts, JetCool provides cooling solutions such as sealed cold plates, liquid-to-chip products, and scalable coolant distribution units (CDUs) capable of handling up to 2MW of cooling. This acquisition enables Flex to integrate these technologies into its vertically integrated data center racks, supporting mass deployment with improved performance, efficiency, and sustainability.
• JetCool offers microconvective cooling technology for hyperscale, enterprise, and semiconductor customers.
• Product range includes direct liquid-to-chip cooling, hotspot-targeted cooling, and turn-key cooling systems.
• Flex’s expanded portfolio will address growing thermal density and power challenges in AI workloads.
• JetCool’s CDU supports rack cooling up to 300kW, scalable for row configurations exceeding 2MW.
• Flex integrates JetCool’s solutions with its manufacturing and lifecycle services for large-scale data centers.
“The addition of JetCool’s advanced liquid cooling technology strengthens our ability to help customers address increased power, thermal density, and cooling requirements across the full spectrum of AI workloads and high-performance computing,” said Michael Hartung, President and Chief Commercial Officer, Flex.
