Apple announced a new $100 billion commitment to U.S.-based innovation and manufacturing under a bold initiative called the American Manufacturing Program (AMP). This announcement brings Apple’s total U.S. investment plan to $600 billion over the next four years, aimed at bolstering American supply chains, accelerating chip production, and generating tens of thousands of new jobs.
The program focuses heavily on onshoring critical parts of Apple’s global supply chain, especially in silicon manufacturing, optical components, rare earth materials, and advanced chip packaging. In doing so, Apple is working closely with a group of key technology and manufacturing partners—many of whom have long-standing relationships with the company—to establish an end-to-end silicon and advanced components ecosystem entirely within the U.S.
Apple’s Key AMP Partners and Their Roles
Coherent – Sherman, Texas
Apple has entered a new multiyear agreement with Coherent, a company that plays a vital role in producing vertical-cavity surface-emitting lasers (VCSELs)—the compact optical components that power Face ID and other depth-sensing features on iPhones and iPads. The manufacturing is based at Coherent’s facility in Sherman, Texas, marking a continued partnership with Apple that strengthens domestic capabilities in precision photonics. VCSEL technology is critical not only for biometrics but also for proximity sensing and AR applications, all of which are strategic areas for Apple’s future device roadmap.
Broadcom – U.S. Cellular and RF Components
Apple is deepening its relationship with Broadcom to develop and manufacture key radio frequency (RF) components needed for cellular connectivity, particularly 5G. This includes FBAR filters and front-end modules, which are essential to managing signal integrity in complex wireless environments. Broadcom will supply these components from U.S.-based facilities, with Apple helping fund manufacturing scale-up. The partnership supports Apple’s objective of ensuring domestic control over strategic telecommunications components, which are increasingly vital as Apple expands its wireless offerings.
GlobalFoundries – Malta, New York
In a renewed strategic partnership, GlobalFoundries will manufacture semiconductors for wireless technologies and power management at its upstate New York facility. These chips underpin efficient battery usage and reliable connectivity in iPhones and other Apple devices. GlobalFoundries is a longtime Apple supplier and a key link in the U.S. foundry landscape. The investment is expected to bring new jobs and capabilities to the Malta campus and boost Apple’s resilience in chip production for essential functions that are often taken for granted, like efficient charging and signal switching.
Amkor – Chandler, Arizona
Apple is making a major investment in Amkor’s new advanced semiconductor packaging and test facility in Arizona. This facility will serve as the final stage in Apple’s domestic chip production, packaging silicon manufactured at TSMC’s nearby fab into complete, ready-to-integrate components. Apple will be the site’s first and largest customer, enabling a new generation of U.S.-made chips to flow through an entirely American pipeline—from silicon wafer to final product packaging. This effort is part of Apple’s strategy to localize cutting-edge system-in-package (SiP) and fan-out packaging capabilities, traditionally concentrated in Asia.
GlobalWafers America – Sherman, Texas
GlobalWafers America (GWA) will play a pivotal role at the very start of Apple’s silicon supply chain. Apple is working with GWA to produce 300mm silicon wafers for the first time in the U.S. using U.S.-sourced raw silicon. These wafers are the raw material for chips manufactured by fabs such as TSMC in Phoenix, Arizona, and Texas Instruments in Sherman, Texas. The wafers will come from a GWA facility in Sherman, which uses silicon from Corning’s Hemlock Semiconductor, also based in the U.S. This partnership is critical in establishing true domestic sovereignty over chip material supply.
Texas Instruments – Sherman, Texas & Lehi, Utah
Texas Instruments (TI), one of the most experienced analog and embedded semiconductor companies, is expanding its collaboration with Apple. New investments will support additional tooling at TI’s Lehi, Utah facility, and help bring online a new fab in Sherman, Texas. Both sites will produce core semiconductors for Apple’s devices, including those used in signal processing, power regulation, and analog-to-digital conversion. TI fabs will be powered by chipmaking equipment from Applied Materials and use wafers from GlobalWafers America, underscoring the full-stack integration Apple is pursuing.
Applied Materials – Austin, Texas
To ensure domestic access to the equipment needed for chip fabrication, Apple is partnering with Applied Materials to expand its production of advanced semiconductor manufacturing tools in the U.S. The company’s Austin site is a crucial hub for developing and producing deposition, etching, and inspection systems used in advanced process nodes. These tools are essential for partners like TI and TSMC to produce Apple’s high-performance silicon chips. By investing upstream in equipment manufacturing, Apple is shoring up the supply chain at its most technical and capital-intensive layers.
Samsung – Austin, Texas
Samsung is collaborating with Apple to deploy a never-before-used chipmaking technology at its fab in Austin. While details are limited, the project is focused on optimizing performance and power efficiency—an area where Apple consistently pushes the limits. Samsung has been a critical Apple partner on NAND flash and display technologies, and this new collaboration expands their relationship into innovative logic chip fabrication within the U.S. The project marks another instance of Apple backing early adoption of next-generation process technologiesonshore.
Corning – Harrodsburg, Kentucky & Hemlock, Michigan
Corning is expanding its long-running partnership with Apple to build the world’s largest smartphone glass production line at its Harrodsburg facility. This Kentucky-made cover glass will be used in every iPhone and Apple Watch globally. The companies are also launching a new Apple-Corning Innovation Center to advance glass science and manufacturing processes. In parallel, Corning’s Hemlock Semiconductor subsidiary will provide high-purity polysilicon to GlobalWafers America—ensuring that the raw silicon supply chain for Apple’s chips remains domestic.
MP Materials – Fort Worth, Texas & Mountain Pass, California
Apple is working with MP Materials, the only vertically integrated rare earth magnet producer in the U.S., to supply and recycle critical rare earth magnets for Apple products. The partnership includes an expansion of MP’s Fort Worth processing facility and the establishment of a new recycling line in Mountain Pass, California. These magnets are essential for device haptics, speakers, and Taptic engines, and sourcing them domestically helps Apple reduce geopolitical risk and improve circularity in materials.
End-to-End U.S. Silicon Supply Chain by 2025
Apple now expects to produce over 19 billion chips for its products in the U.S. in 2025, through a combination of design, fabrication, packaging, and testing conducted entirely within the country. At the center of this pipeline is TSMC’s fab in Phoenix, Arizona, where Apple is the first and largest customer. Apple’s commitment also includes major new infrastructure and workforce development initiatives:
- Houston server factory: A 250,000 sq. ft. facility producing Apple Intelligence servers for Private Cloud Compute will ramp to volume in 2026.
- Detroit Manufacturing Academy: A new training center opening August 19 to help small and medium businesses adopt advanced manufacturing and AI.
- Data center expansions: Ongoing work at Apple’s Maiden, North Carolina, facility, with additional expansions in Iowa, Nevada, and Oregon—all powered by 100% renewable energy.
- Austin campus: Construction continues on Apple’s second Austin campus, which will house expanded R&D and engineering teams across hardware, silicon, and software.
