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Home » Apple’s new M2 Ultra leverages its UltraFusion silicon interposer

Apple’s new M2 Ultra leverages its UltraFusion silicon interposer

June 5, 2023
in Semiconductors
A A

Apple’s new flagship M2 Ultra system on a chip (SoC) is built using a second-generation 5-nanometer process and the company’s “UltraFusion” silicon interposer technology to connect the die of two M2 Max chips. The design connects the dies with more than 10,000 signals, providing over 2.5TB/s of low-latency interprocessor bandwidth.

The M2 Ultra chip boasts 134 billion transistors — 20 billion more than M1 Ultra — andsupports up to 192GB of unified memory capacity with 800GB/s of memory bandwidth. The GPU can be configured with 60 or 76 next-generation cores. The Neural Engine features 32 cores delivering 31.6 trillion operations per second.

Apple says the M2 Ultra CPU is 20 percent faster than M1 Ultra, the GPU is up to 30 percent faster, and the Neural Engine is up to 40 percent faster.

Source: Apple
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Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

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