• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 17, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » AppliedMicro Introduces PacketPro Multicore Processor

AppliedMicro Introduces PacketPro Multicore Processor

September 26, 2010
in Uncategorized
A A

AppliedMicro introduced its next-generation PacketPro multicore processor System-on-a-Chip (SoC) family designed for multifunction printers, network control planes, access points, and industrial/security applications.

PacketPro is AppliedMicro’s second-generation embedded processor SoC family and features offload of critical features for multiple PowerPC processors with frequency capabilities ranging in performance from 600 MHz to 2.0 GHz and up. The line will employ 40nm technology and usage-based power management to reduce energy consumption. A multi-level crypto engine offers simultaneous wire-speed performance along with investment protection against product cloning and hardware-software tampering.

“PacketPro is an advanced SoC architecture that offers an ideal combination of high-performance and low power consumption at low cost,” said Vinay Ravuri, Vice President and General Manager of AppliedMicro’s Processing Products Division. “Flexible power management enables deep sleep operating power of less than 200mW and includes Wake on LAN, USB, PCIe and others. With the ability to scale-down and turn off SoC resources when not in use and to scale-up to full power when system demands require, PacketPro provides developers unprecedented ability to dynamically control power consumption levels.”

Some key features include: performance of up to 2 GHz per core, 32KB L1 I/D & 256KB dedicated L2 cache per core, support for full symmetric multiprocessing (SMP) and ultra flexible asymmetric multiprocessing (AMP). Memory and bus architecture supports 16/32/64-bit DDR2/3 up to 1,600Mbps and beyond with ECC option. Connectivity features include PCI-e Gen 2 controller, GE, 10GE, SGMII, RGMII, IEEE1588 Rev2 on all Ethernet ports, USB 2.0 – H/D, OTG, all with integrated PHY, USB 3.0, SATA ports and SDHC. The PacketPro family is manufactured on a 40nm TSMC CMOS process and is available in both wire-bond and flip-chip packaging. The first PacketPro device begins sampling in November. http://www.appliedmicro.com

Tags: AllAppliedMicroCaviumService ProvidersSilicon
ShareTweetShare
Previous Post

Video: Silicon MEMS Timing Replaces Quartz

Next Post

Sandvine's Usage Management Enables Accurate Usage-Based Billing

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

Fujitsu Launches Infrastructure as a Service (IaaS) in Japan

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version