The Department of Commerce and Natcast have announced Arizona State University (ASU) Research Park in Tempe, Arizona, as the planned site for the third CHIPS for America research and development (R&D) flagship facility. The new Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF) will focus on bridging the gap between laboratory semiconductor research and full-scale production. Expected to be operational in 2028, the facility will feature the world’s first 300mm front-end semiconductor manufacturing and advanced packaging research environment, supporting national security and economic growth through domestic innovation.
The facility will include a 300mm complementary metal-oxide-semiconductor (CMOS) baseline line for R&D experiments, along with specialized tools for testing novel materials and device architectures. It will also feature an advanced packaging pilot line for developing next-generation packaging technologies and will provide a collaborative space for hands-on research. The PPF will support U.S. workforce development by offering opportunities for researchers across industry, academia, and startups to experiment with cutting-edge semiconductor technologies.
The ASU facility will join two other CHIPS R&D flagship sites, the EUV Accelerator and the Design and Collaboration Facility, forming a network of advanced semiconductor research hubs. The Department of Commerce and Natcast expect to announce further details about the selection of affiliated technical centers in the coming months. Natcast has signed a nonbinding Letter of Intent with the Arizona Commerce Authority and ASU, with the final contract pending additional negotiations.
• Arizona State University Research Park selected as the third CHIPS for America R&D facility site.
• Facility to feature a 300mm front-end semiconductor manufacturing and advanced packaging pilot line.
• Project aims to bridge lab research with full-scale semiconductor production.
• Expected operational date: 2028.
• Focus areas: novel materials, device architectures, and advanced packaging.
• Designed to support workforce development and collaboration between industry, academia, and startups.
• Final agreement pending further negotiations and due diligence.
“The PPF will play a critical role in advancing semiconductor innovation across the country,” said Deirdre Hanford, Natcast CEO. “This facility will be a premier destination where researchers from industry, academia, startups, and the broader semiconductor ecosystem will convene to explore, experiment, and collaborate on the next generation of semiconductor and packaging technologies that will power the industries of the future.”
