• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 10, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » AWS Looks to Intel for AI Fabric Chip

AWS Looks to Intel for AI Fabric Chip

September 16, 2024
in Semiconductors
A A

Intel and Amazon Web Services (AWS) announced a major expansion of their long-term partnership, focusing on co-developing custom chip designs under a multi-billion-dollar, multi-year framework. Intel will produce an AI fabric chip for AWS using its most advanced process node, Intel 18A, and a custom Xeon 6 chip on Intel 3. These developments build on their existing collaboration, where Intel already manufactures Xeon Scalable processors for AWS. The expanded partnership aims to power a broad range of customer workloads and boost the performance of AI applications.

Both companies highlighted their commitment to U.S.-based semiconductor manufacturing, particularly in Ohio, where Intel continues to build advanced production facilities. AWS plans to invest an additional $7.8 billion into its data center operations in Central Ohio, on top of the $10.3 billion it has already invested since 2015. Looking ahead, Intel and AWS plan to explore new designs using Intel 18A and future process nodes such as Intel 18AP and Intel 14A, with production slated for Intel’s Ohio plants.

• Intel to produce AI fabric chips on Intel 18A for AWS

• Custom Xeon 6 chips to be built on Intel 3 for AWS workloads

• AWS will invest an additional $7.8 billion in Central Ohio data centers

• Intel continues to develop its semiconductor manufacturing hub in Ohio

• Intel and AWS to explore future chip designs for U.S. production

“This expansion of our longtime relationship with AWS reflects the strength of our process technology and delivers differentiated solutions for customer workloads,” said Pat Gelsinger, Intel CEO.

Source: Intel
Tags: AWSIntel
ShareTweetShare
Previous Post

Intel Expands Defense Chip Production with $3 Billion in CHIPS Act Funding

Next Post

CAMARA Delivers First Major Release with 25 Telecom APIs 

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

Amazon Leo Aims for 1 Gbps down / 400 Mbps up, Direct Hop to AWS
Space

Amazon Leo Aims for 1 Gbps down / 400 Mbps up, Direct Hop to AWS

November 24, 2025
AWS Commits Up to $50B to Build AI Infrastructure for U.S. Government
AI Infrastructure

AWS Commits Up to $50B to Build AI Infrastructure for U.S. Government

November 24, 2025
AWS and HUMAIN Plan Riyadh “AI Zone” with Up to 150,000 Accelerators
AI Infrastructure

AWS and HUMAIN Plan Riyadh “AI Zone” with Up to 150,000 Accelerators

November 19, 2025
AWS Unveils Fastnet Cable Linking Maryland and Ireland
Subsea

AWS Unveils Fastnet Cable Linking Maryland and Ireland

November 4, 2025
Verizon Business and AWS Sign New AI Fiber Network Deal
Clouds and Carriers

Verizon Business and AWS Sign New AI Fiber Network Deal

November 3, 2025
OpenAI Signs $38 Billion, Multi-Year Deal with AWS
AI Infrastructure

OpenAI Signs $38 Billion, Multi-Year Deal with AWS

November 3, 2025
Next Post
CAMARA Delivers First Major Release with 25 Telecom APIs 

CAMARA Delivers First Major Release with 25 Telecom APIs 

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version