Ayar Labs appointed Pooya Tadayon as its Vice President of Packaging and Test.
Tadayon was formerly a Fellow and Director of Assembly & Test Pathfinding within Intel’s Assembly and Test Technology Development (ATTD) group. He holds 47 patents and has over three dozen pending, in areas including test interconnect technology, thermal technology, and package/product architecture.
“The demand for photonics technology is rapidly increasing to meet the bandwidth and energy requirements of AI,” said Tadayon. “My goal at Ayar Labs is to accelerate assembly and test ecosystem maturation to support the volumes being projected for optical I/O in AI connectivity.”
Tadayon will lead the creation of an efficient OSAT (outsourced semiconductor assembly and test) process that will enable the photonics ecosystem and accelerate the adoption of Ayar Labs’ solutions.
