Ayar Labs and Taiwan-based Alchip Technologies announced a strategic partnership to accelerate the deployment of co-packaged optics (CPO) for AI scale-up infrastructure. The collaboration combines Ayar Labs’ optical I/O technology with Alchip’s advanced packaging expertise and leverages TSMC’s CoWoS, SoIC, and COUPE™ packaging processes.
The companies said the partnership directly addresses hyperscaler demand for high-performance AI accelerators and scale-up platforms capable of extending memory and compute resources across multi-rack architectures. By integrating Ayar’s optical engines with Alchip’s ASIC designs, the solution targets high-bandwidth, low-latency interconnects that reduce power consumption while overcoming copper limitations.
Alchip Chairman and CEO Johnny Shen noted that “current and future AI workloads require innovative and often collaborative advanced packaging design expertise and production-ready solutions,” while Ayar Labs CEO and co-founder Mark Wade emphasized that “co-packaged optics unlocks the next era of AI infrastructure by removing the limitations of copper interconnects.”
- Partnership unites Ayar Labs’ CPO technology with Alchip’s high-performance ASIC design
- Builds on TSMC’s advanced packaging platforms, including CoWoS and SoIC
- Targets hyperscaler AI scale-up infrastructure requiring multi-rack interconnects
- Enables high-bandwidth, low-latency links with lower power than copper
- Alchip serves tier-1 customers in AI, HPC, networking, and consumer devices
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