Ayar Labs will demonstrate the first 4 terabit-per-second (Tbps) bidirecti onal Wavelength Division Multiplexing (WDM) optical solution at the upcoming Optical Fiber Communication Conference (OFC) in San Diego on March 5-9, 2023.
At OFC, Ayar Labs will show its optical I/O solution moving data from one TeraPHY optical I/O chiplet to another at 2.048 Tbps each direction powered by their SuperNova light source. SuperNova powers 8 fiber links (using 64 highly accurate wavelengths operating at 32 Gbps, for 8 wavelengths and 256 Gbps per individual fiber) running error free at lower than 10ns of latency and without needing Forward Error Correction (FEC). This allows for a total bandwidth of 2.048 Tbps each direction, or 4.096 Tbps bidirectional. More importantly, the data transfer is using less than 5 pJ/bit (10W), a high level of energy efficiency, providing the power density and performance per watt needed to achieve AI models with trillions of parameters, advanced HPC designs and more.
Ayar Labs is using working with high-volume manufacturing and supply partners including GlobalFoundries, Lumentum, Macom, Sivers Photonics and others to deliver the optical interconnects needed for data-intensive applications.
“In-package optical I/O solutions have the potential to transform how semiconductor, AI, HPC and aerospace customers process their next-generation, data-intensive workloads,” said Craig Thompson, vice president of Business Development for Networking at NVIDIA. “NVIDIA’s accelerated computing platform is enabled by advanced technologies such as WDM optical interconnects to equip tomorrow’s innovators with the extreme performance they need.”
“Ayar Labs continues to showcase our technology leadership with this live silicon demonstration, an industry-first milestone on the path to overcoming the impending power and performance wall of electrical design, and unleashing the power of next generation compute,” said Charlie Wuischpard, CEO, Ayar Labs. “As we bring together all the supply, manufacturing, test and compute pieces needed for high-volume deployment, we also show today that we continue to lead in pure technical achievement.”
