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Home » Ayar Labs demos terabit link for Co-Packaged Optics and chip-to-chip

Ayar Labs demos terabit link for Co-Packaged Optics and chip-to-chip

June 8, 2021
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Ayar Labs demonstrated the industry’s first Terabit per second Wavelength Division Multiplexing (WDM) optical link with its TeraPHY optical I/O chiplet and SuperNova multi-wavelength optical source. 

The demonstration shows a fully functional TeraPHY chiplet with 8 optical ports running error free without Forward Error Correction (FEC) for a total bandwidth of 1.024 Tbps and at less than 5 pJ/bit energy efficiency. 

“This is yet another industry first demonstration of our technology which promises to transform computing and extend the benefits of Moore’s Law,” said Charles Wuischpard, CEO, Ayar Labs. “Digital transformation is being driven by cloud, connectivity, artificial intelligence, and intelligent edge; our roadmap of products and custom solutions is tailored to serve these high-volume market segments. We remain on track to deliver on several customer commitments by end of year.”

Ayar Labs also demonstrated the industry’s first multi-wavelength, multi-port optical source with 64 addressable wavelengths. Named SuperNova, it offers eight times the number of wavelengths compared to commercially available pluggable products. The SuperNova is also the first product compliant with the optical source specifications of the CW-WDM MSA, an industry consortium that drives standards for advanced optical communication and computing applications that require a leap in performance, efficiency, cost, and bandwidth scaling. The multi-wavelength source leverages laser technology from MACOM, a leading supplier of lasers and optoelectronics for telecommunications and data center applications.

“MACOM’s novel laser arrays are ideal for silicon photonics and co-packaged optics,” said Stephen G. Daly, President and CEO of MACOM. “As a promoter-level member of the CW-WDM MSA, we are excited to collaborate with Ayar Labs on the next generation of optical devices based on the MSA’s new specification.”

The details of this industry-first demonstration will be presented as a postdeadline paper by Dr. Mark Wade, Co-Founder and CTO of Ayar Labs, on Friday, June 11 at 9:15 a.m. PDT at the Optical Fiber Communication Conference (OFC) 2021. OFC postdeadline papers represent the latest and most advanced technical achievements in the field.

(available via OFC conference web site for registrants)

https://ayarlabs.com

Ayar Labs hits key milestone for chip-to-chip optical connectivity

Wednesday, December 02, 2020  Ayar, GlobalFoundries  

 Ayar Labs demonstrated its patented monolithic electronic/photonic solution on Globalfoundries’ next-gen photonics solution based on its 45nm platform. The companies said this industry-first demonstration is a key milestone in providing chip-to-chip optical connectivity at scale. The two companies began working together in 2015 with a commitment to collaborate and commercialize differentiated silicon photonics solutions for greenfield…

READ MORE

Lockheed Martin Ventures invests in Ayar Labs

Monday, March 02, 2020  Ayar, Funding, Silicon Valley, Start-Ups  

Lockheed Martin Ventures has made a strategic investment in Ayar Labs, a start-up that is developing  monolithic in-package optical I/O (MIPO) solution for applications that require high bandwidth, low latency and power efficient short reach interconnects. Financial terms were not disclosed. Ayar Labs publicly demonstrated its monolithic electronic photonic TeraPHY chiplet at the Supercomputing 2019 conference and is now working with select…

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Ayar Labs selected for Intel’s DARPA PIPES Project

Thursday, November 21, 2019  Ayar, DARPA  

Ayar Labs has been selected as Intel’s optical I/O solution partner for their recently awarded DARPA PIPES (Photonics in Package for Extreme Scalability) project. The PIPES project aims to develop integrated optical I/O solutions co-packaged with next generation FPGA/CPU/GPU and accelerators in Multi-Chip Packages (MCP) to provide extreme data rates (input/output) at ultra-low power over much longer distances than supported by current technology….

READ MORE

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