• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Saturday, April 11, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Black Semiconductor raises EUR 254.4 million for graphene PICs

Black Semiconductor raises EUR 254.4 million for graphene PICs

June 19, 2024
in All
A A

Black Semiconductor, a start-up based in Aachen, Germany, announced €254.4 million in funding, marking one of the largest investments for a deep tech company manufacturing chips in Europe to date.

The company is targeting optical chip-to-chip connections using graphene as an intermediate layer to integrate optics with electronics. Black Semiconductor asserts that graphene, a material just one atom thick and known for its superior optical, electrical, and thermal properties, is key to enabling the co-integration of electronics and optics. “Graphene outperforms any other material system, opening the door to products that were previously inaccessible,” the company stated. “Our solution combines computing with electrons and communication with photons, which we believe could enable parallel optical chip connectivity over distances of up to kilometers.”

Black Semiconductor has secured €228.7 million in public funding from the German Ministry of Economic Affairs and Climate Action and the state of North Rhine-Westphalia over the next seven years under the IPCEI ME/CT2 program. Additionally, the company has raised €25.7 million in equity funding. This round was led by Porsche Ventures and Project A Ventures, with participation from leading venture capital firms, corporates, and industry leaders including Scania Growth Capital, Capnamic, Tech Vision Fonds, and NRW.BANK, joining the seed round investors Vsquared Ventures, Cambium Capital, and Hermann Hauser’s Onsight Ventures.

Founded in 2020 by Dr. Daniel Schall and Sebastian Schall, Black Semiconductor plans to use the new capital to accelerate its R&D initiatives and establish pilot line manufacturing capabilities in Aachen by 2026—an essential step towards its long-term goal of producing and implementing high-quality graphene in Europe. The company also aims to increase its headcount from 30 to 120 by 2026.

Tags: BlackGermany
ShareTweetShare
Previous Post

HPE teams with NVIDIA on Private-Cloud AI 

Next Post

Dell’Oro: Cable Outside Plant Equipment revenues rise 15% yoy

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

BerryComm Expands Central Indiana Fiber with Nokia
5G / 6G / Wi-Fi

Telefónica Germany Awards Nokia a 5-Year RAN Modernization Deal

November 26, 2025
T-Systems signs MoU with Shell Gas & Power
Clouds and Carriers

Deutsche Telekom: Network Investments Reshape Q3 2025 Performance

November 13, 2025
Vodafone, AST SpaceMobile Pick Germany for EU Sovereign Direct-to-Mobile Satellite Hub
Space

Vodafone, AST SpaceMobile Pick Germany for EU Sovereign Direct-to-Mobile Satellite Hub

November 7, 2025
Deutsche Telekom Looks to NVIDIA for €1B Industrial AI Cloud
AI Infrastructure

Deutsche Telekom Looks to NVIDIA for €1B Industrial AI Cloud

November 6, 2025
Astera Labs Expands PCIe 6.x Interoperability Testing
Optical

Astera Labs Acquires aiXscale Photonics to Advance Optical Chiplet Integration 

October 22, 2025
DT Raises 2025 Outlook Amid Strong U.S. Momentum, AI Strategy, and FTTH
Clouds and Carriers

DT Raises 2025 Outlook Amid Strong U.S. Momentum, AI Strategy, and FTTH

August 7, 2025
Next Post
Crehan Research: Fibre Channel host bus adapter market rebounds strongly

Crehan Research: Fibre Channel host bus adapter market rebounds strongly

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version