• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Sunday, April 19, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » Broadcom Acquires Beceem for Multimode LTE/WiMAX Chipsets

Broadcom Acquires Beceem for Multimode LTE/WiMAX Chipsets

October 12, 2010
in Uncategorized
A A

Broadcom will acquire Beceem Communications , a privately-held developer of 4G chipsets, for approximately $316 million in cash.

Beceem has been a developer of WiMAX silicon solutions, but earlier this year announced plans for chipset that address both LTE and WiMAX. The company claims its silicon technology supports peak broadband download speeds of up to 200Mbps. Its existing WiMAX chip has been seen major deployment in the Clearwire/Sprint ecosystem through leading OEMs and ODMs.

Broadcom said the deal accelerates its entry into the 4G market. Beceem’s technology will be combined with Broadcom’s 2G/3G cellular solutions, wireless LAN, Bluetooth, GPS, Ethernet switching and other associated IP.

Beceem’s Chief Executive Officer, Surendra Babu Mandava, said: “When combined with Broadcom’s 2G and 3G cellular solutions and broader wired and wireless communications portfolio, our 4G products will enable operators to roll out next generation wireless broadband solutions while providing support for existing networks. Our combined offering will be one of the most extensive and formidable in the industry.”

About Beceemhttp://www.broadcom.com
http://www.beceem.com

  • In February 2010, Beceem Communications announced plans for a single chip that integrates both LTE and WiMAX technology. The BCS500 multi-mode chip will support the latest revisions of the IEEE 802.16 standard, namely 16e and 16m, as well as the 3GPP-LTE standard, based on Release 8 specifications. It is the only device chip to support UE Class 4 capabilities. In addition, it will support both TDD and FDD configurations for LTE and IEEE 802.16m, even enabling real-time band/channel reconfiguration through a unique multi-mode “autosense” feature that automatically detects the network type. Beceem expects to begin sampling in Q4 2010 with mass production in Q2 2011.
  • Beceem was founded in October 2003 and is based in Santa Clara, California with engineering offices in Irvine and Bangalore.
  • Beceem is headed by Babu Mandava, who previously was a co-founder of Centillium Communications, a semiconductor company well known for product innovations in ADSL and VOIP. Beceem was also co-founded by Dr. Arogyaswami Paulraj, a professor at Stanford where he supervises the Smart Antennas Research Group. Prior to Beceem, Paulraj founded Iospan Wireless Inc., which was later acquired by Intel.
Tags: AllSilicon
ShareTweetShare
Previous Post

SA Forum: "There's No Upside to Downtime"

Next Post

RadiSys Unveils ATCA-based LTE Security Gateway

Staff

Staff

Related Posts

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips
Data Centers

Montage Technology Samples PCIe 6.x/CXL 3.x Retimer Chips

January 22, 2025
Intel marks first EUV light at Fab 34 in Ireland
Semiconductors

Intel marks first EUV light at Fab 34 in Ireland

December 30, 2022
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Huawei and Orange achieve 157 Tbps over 120km fiber link

Huawei and Orange achieve 157 Tbps over 120km fiber link

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
Next Post

Spread Networks Guarantees 15.75ms Latency for NYC-Chicago

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version