Broadcom announced shipping of its 5nm 200G/lane optical PAM-4 DSP PHY featuring 200G/lane serial optical interfaces, which enable 800G and 1.6T pluggable optical transceiver modules.
The new Sian BCM85822 is optimized for the 1.6T OSFP-XD transceiver module design and would effectively enable 51.2T switching capacity in a 1RU rack to improve bandwidth density in hyperscale data centers. Further, the adoption of 200G/lane optical interfaces lays the foundation for the eventual deployment of 1.6T and 3.2T solutions with 200G/lane electrical interfaces, which are needed for cloud providers to support next generation switches and scale AI workloads.
Highlights
- Monolithic 5nm 800G (8:4) PAM-4 DSP with integrated laser driver
- Delivers best-in-class module performance in BER and power consumption
- Proven interoperability with Broadcom’s 200G EML
- Compliant to all IEEE and OIF standards, capable of supporting MR links on the chip to module electrical interface
- Supports optical modules from 800G to 1.6T
- Supports IEEE compliant (128,120) Hamming Inner Code
“This latest generation of DSP operating at 200G/lane extends Broadcom’s leadership in high-bandwidth PHY and enables the lowest power optical modules in the industry,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “This, in turn, lays the foundation for next generation switching platforms for AI/ML clusters and networks.”
