At #OFC23, Broadcom announced sampling of its 5nm 100G/lane optical PAM-4 DSP PHY with integrated transimpedance amplifier (TIA) and laser driver.
The new BCM85812, which is optimized for 800G DR8, 2x400G FR4 and 800G AOC module applications, is based on the company’s existing 5nm 112G PAM-4 DSP platform.
Highlights
- Monolithic 5nm 800G PAM-4 PHY with integrated TIA and high-swing laser driver
- Delivers best-in-class module performance in BER and power consumption.
- Drives down 800G module power for SMF solutions to sub 11W and MMF solutions to sub 10W.
- Compliant to all applicable IEEE and OIF standards, capable of supporting MR links on the chip to module interface.
- Fully compliant with OIF 3.2T Co-Packaged Optical Module Specs
- Capable of supporting optical modules from 800G to 3.2T
At OFC, Broadcom demonstrated the BCM85812 in an end-to-end link connecting two Tomahawk 5 (TH5) switches using Eoptolink’s 800G DR8 optical modules.
“This first-to-market highly integrated 5nm 100G/lane DSP PHY extends Broadcom’s optical PHY leadership and demonstrates our commitment to addressing the stringent low power requirements from hyperscale data center and cloud providers,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “With our advancement in 200G/lane, Broadcom continues to lead the industry in developing next generation solutions for 51.2T and 102.T switch platforms.”
