Broadcom has launched its third-generation co-packaged optics (CPO) platform featuring 200G per lane optical connectivity, pushing the performance envelope for AI-scale networks. The company also reaffirmed the maturity of its second-gen 100G/lane CPO platform—now in volume production—and revealed early development of a fourth-gen 400G/lane solution. These developments mark a significant leap in network interconnect speed and energy efficiency, addressing the bandwidth and power requirements of hyperscale AI clusters.
The third-gen CPO platform builds on Broadcom’s Tomahawk 5-Bailly (TH5-Bailly) silicon switch, integrating high-density optical engines with automated manufacturing and test capabilities. Broadcom highlighted key ecosystem milestones, including new production deployments from Delta Electronics (3RU 51.2Tbps switches), Foxconn Interconnect (PLS cages and sockets), Micas Networks (30% power savings over pluggables), and Twinstar Technologies (volume shipment of high-density fiber cables). Corning has also joined Broadcom in supplying optical components optimized for 100G/lane and future 200G/lane platforms.
The Gen 3 CPO solutions are aimed at ultra-high radix architectures exceeding 512-node domains, addressing reliability, latency, and cost-per-token requirements crucial for AI model training and inference. Broadcom emphasized its commitment to open standards and system-level optimization as it scales its CPO technology roadmap to meet the needs of next-gen AI infrastructure.
- Third-generation Broadcom CPO products support 200G/lane optical interconnects.
- Second-gen 100G/lane TH5-Bailly platform now in full volume production.
- Ecosystem partners include Corning, Delta, Foxconn, Micas, and Twinstar.
- Gen 3 targets scale-up domains >512 nodes for large AI model training and inference.
- Broadcom is already developing fourth-gen 400G/lane CPO solutions.
“Broadcom has spent years perfecting our CPO platform solutions… With our third-generation 200G/lane CPO solutions, we are once again setting the bar for the next-generation of AI interconnects,” said Near Margalit, Ph.D., VP and GM of the Optical Systems Division, Broadcom.
