Broadcom expanded its DSP PHY portfolio with two new products designed specifically for next-generation AI infrastructure: the Sian3 DSP PHY and the Sian2M DSP PHY. These 200G-per-lane DSPs target the rapidly growing demand for high-bandwidth, low-power optical interconnects essential for AI and machine learning (ML) clusters. Built on 3nm process technology, the Sian3 DSP provides power efficiency for 800G and 1.6T optical transceivers over single-mode fiber (SMF), delivering over 20% power savings compared to previous-generation DSPs. In parallel, the Sian2M DSP is the industry’s first 200G-per-lane DSP PHY with integrated VCSEL drivers, optimized specifically for short-reach multi-mode fiber (MMF) connectivity within AI clusters, greatly enhancing efficiency and performance.
The Sian3 DSP features ultra-low-power performance, enabling sub-13W 800G and sub-23W 1.6T transceivers, along with support for multiple FEC options and industry standards including IEEE 802.3dj. It integrates low-swing and high-swing laser drivers suited for both EML and SiP modules.
The complementary Sian2M DSP PHY, built on a 5nm process, offers integrated VCSEL drivers, enabling sub-25W 1.6T SR8 transceivers and supporting a variety of FEC configurations. These solutions leverage Broadcom’s extensive expertise in VCSEL technology, with over 50 million channels deployed and billions of device-hours logged with extremely low failure rates.
Broadcom’s new Sian DSP products enable optical module developers to accelerate delivery of cost-effective and power-efficient solutions to hyperscale customers. The Sian DSP family is complemented by Broadcom’s existing 200G-per-lane EML and VCSEL laser portfolio, already deployed in volume, ensuring module manufacturers can rapidly address the growing market for high-speed AI connectivity.
“Broadcom’s Sian family of DSP PHYs is foundational to the low-power, high-bandwidth optical connectivity needed for AI and ML clusters,” said Vijay Janapaty, vice president and general manager at Broadcom. “These innovations enable customers to efficiently scale AI clusters to meet rising workload demands while significantly reducing power consumption.”
• Broadcom announces new 200G-per-lane DSP PHYs: Sian3 for single-mode fiber and Sian2M for short-reach multi-mode fiber.
• Sian3 (3nm DSP PHY) delivers over 20% power reduction for 800G/1.6T SMF optical transceivers.
• Sian2M (5nm DSP PHY) integrates VCSEL drivers, optimizing performance for short-reach AI connectivity.
• Products support IEEE 802.3dj, InfiniBand, Ethernet standards, and multiple FEC options.
• Solutions complement Broadcom’s extensive portfolio of 200G EML and VCSEL lasers, deployed in volume for AI connectivity.
“Broadcom’s Sian family of DSP PHYs is foundational to the low-power, high-bandwidth optical connectivity needed for AI/ML clusters,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “Our new 3nm Sian3 delivers over 20% power reduction for 1.6T optical modules, while Sian2M with integrated VCSEL drivers and 200G VCSELs brings cost and power efficiency to short-reach links. These innovations enable our customers to scale AI clusters to meet the demands of growing AI workloads.”
- DSP PHY (Digital Signal Processor Physical Layer) chips convert high-speed digital signals into optical signals, performing modulation, equalization, and error correction necessary for reliable high-speed links.
