At OFC 2025, Broadcom showcased its powerful portfolio of optical and electrical interconnect solutions for AI infrastructure. The company highlighted advances across co-packaged optics (CPO), 200G/lane DSP and SerDes technologies, PCIe Gen6 over optics, and new optical modules targeting 800G, 1.6T, and beyond. The demonstrations, which span front-end and back-end AI cluster connectivity, outline Broadcom’s vision for enabling 200 Tbps interconnect systems.
A major highlight was the XPU-CPO, the industry’s first 6.4Tbps optics attach designed for custom AI accelerators, providing high-bandwidth scale-up connectivity within server fabrics. Broadcom also introduced Sian3, a 3nm 200G/lane DSP offering ultra-low power for single-mode optics, and Sian2M, the first 200G/lane DSP with integrated VCSEL drivers for short-reach multimode fiber links. Additional demos included 200G VCSEL, EML, and CW laser technologies, and the industry’s first 400G EML transceiver for next-generation AI optical links.
At its private booth, Broadcom demonstrated PCIe Gen6 over optics, using its established 100G VCSEL and photodetector technology to enhance interconnect performance between AI accelerators and system elements. The company also showcased its 400G LPO-based Ethernet NIC and extended copper connectivity via 7m+ AECs and 200G/lane co-packaged copper solutions—bridging the gap between optics and traditional I/O for hybrid AI architectures.
Broadcom is collaborating with over 15 ecosystem partners and contributing to numerous technical sessions at OFC, addressing topics ranging from 10-meter ML links and co-packaged optics manufacturability to 400G/lambda IMDD and copper-to-optical transition strategies. Together, these technologies and discussions underscore Broadcom’s leadership in driving scalable, open, and efficient optical infrastructure for AI networks.
• XPU-CPO: 6.4Tbps co-packaged optics interface for AI accelerators; long-reach, high-bandwidth server fabric.
• Sian3: 3nm 200G/lane DSP with industry-leading low power for SMF-based 800G/1.6T optics.
• Sian2M: First 200G/lane DSP with integrated VCSEL drivers for low-power MMF links.
• 200G/lane laser tech: Includes VCSEL, EML, and CW lasers for AI front- and back-end links.
• 400G EML: First demo of 400G EML transceiver for AI cluster interconnects.
• PCIe Gen6 over optics: First live demo using 100G VCSEL + PD for scale-up AI connections.
• LPO NIC: 400G PCIe Ethernet NIC (BCM957608) connects to LPO for efficient AI networking.
• Copper innovations: Co-packaged and near-packaged 200G/lane links + 7m+ AEC for 800G.
• Path to 200T: Broadcom’s roadmap emphasizes open, power-efficient scaling for AI systems.
“OFC’s 50th anniversary provides the opportunity to recognize the industry’s many achievements, including Broadcom’s industry-first contributions to this field,” said Charlie Kawwas, Ph. D., President, Semiconductor Solutions Group, Broadcom. “A year ago, Broadcom committed to pushing technical boundaries to pioneer new open, scalable and power-efficient technologies to enable AI infrastructure. Our portfolio of optical interconnect solutions, highlighted at OFC 2025, paves the way to 200T by addressing the performance, power, and scalability challenges of AI clusters.”
