Broadcom unveiled its highest performance, multicore processor to date — the XLP900 Series, packing 80NX CPUs on a single die for 160 Gbps performance. The new XLP900 Series is optimized for deployment of network functions such as hardware acceleration, virtualization and deep packet inspection.
Broadcom’s XLP900 Series, which is implemented in 28nm, extends the company’s portfolio of multicore processors for networking applications. The new flagship processor features end-to-end virtualization, advanced security capabilities such as deep-packet inspection (DPI), and innovative network and application intelligence technology with wire-speed networking and multi-layer QoS capabilities.
Key Features:
- 160Gbps application performance, scalable to 1.28Tbps
- Full end-to-end hardware virtualization support for the CPU cores, I/Os, hardware accelerators and on-chip interconnects
- Supports hundreds of virtual machines (VMs), with protected memory, resources and I/Os, supports KVM (Kernel-based Virtual Machine) and QEMU (open-sourced Quick EMUlater)
- 100Gbps encryption and authentication performance, scalable to 800Gbps
- 40Gbps deep-packet inspection performance with grammar processing, scalable to 320Gbps
- 20Gbps compression and decompression, scalable to 160Gbps
- RAID5/6 engines with deduplication support
Broadcom said up to eight of its XLP900 processor can be linked to function as a single device with 640 NX CPUs for the full 1.28 Tbps system performance. Sampling is underway.
“Our new XLP900 Series of processors integrates server-class CPU core performance with industry-leading networking and communications technology to deliver the industry’s highest performance, most scalable and intelligent processor for next-generation networks,” said Ron Jankov, Broadcom Senior Vice President and General Manager, Processor and Wireless Infrastructure. “By out-executing the industry and being first to market with a multicore solution capable of over a trillion operations per second, we once again raise the bar and further solidify our technical leadership.”
