Bunch of Wires (BoW) Die-to-Die Chiplet Demo

At the first, annual Chiplet Summit in San Jose, California, d-Matrix demonstrated a die-to-die chipset interface based on the emerging Bunch of Wires (BoW) work undertaken by the Open Compute Project (OCP). In this video, Wen-Sin Liew, Analog and Mixed Signal Design Engineer, shares an overview of the demo.