Zayo and Equinix introduced a joint AI Infrastructure Blueprint that sets out a common model for building the networks and data center interconnection required for large-scale AI deployments. Announced at...
Applied Materials and GlobalFoundries (GF) are teaming up to advance photonics manufacturing for next-generation AI and augmented reality (AR) applications. The companies announced plans to establish a dedicated waveguide fabrication...
NEC Corporation launched a new 25Gb/s SFP28 bi-directional (BiDi) optical transceiver designed for 80km transmission, expanding its optical product portfolio. The new module enables high-speed bi-directional transmission over a single...
Adtran will showcase its FSP 3000 open line system (OLS) and 100ZR+/400ZRE coherent pluggables at the center of the OIF’s interoperability showcase next week at ECOC 2025 in Copenhagen. The...
Synopsys expanded its collaboration with TSMC to enable 2D and 3D design solutions across advanced nodes including N3C, N3P, N2P, and A16. The companies certified key Ansys (part of Synopsys)...
Lumentum introduced its new R64 Optical Circuit Switch (OCS), expanding its OCS portfolio for lower port count applications in AI data centers. The R64, designed as a 64x64-port platform, leverages...
SENKO Advanced Components and GlobalFoundries (GF) unveiled a wafer-level detachable fiber connector system at ECOC 2025 that directly addresses a critical challenge in scaling Co-Packaged Optics (CPO) for AI and...
IonQ demonstrated a key milestone in quantum networking by successfully converting photons from visible wavelengths to telecom wavelengths, enabling compatibility between trapped-ion quantum systems and existing fiber optic infrastructure. The...
Microsoft researchers have demonstrated a new microfluidic cooling technology that channels liquid directly into silicon chips, removing heat up to three times more effectively than today’s cold plate systems. The...
NLM Photonics will unveil record-setting third-party validation results for its hybrid organic electro-optic (OEO) technology at ECOC 2025 in Copenhagen. Independent testing confirmed that NLM’s patented silicon organic hybrid (SOH)...
Empower Semiconductor, a start-up based in San Jose, California, raised more than $140 million in Series D financing to expand high-volume production and accelerate innovation in power delivery for AI...
Huawei used its flagship HUAWEI CONNECT 2025 event in Shanghai to outline a sweeping roadmap for AI computing, anchored by its next-generation Ascend processors, a family of massive SuperPoDs and...
At its Huawei CONNECT 2025 event in Shanghai, Huawei unveiled Xinghe AI Fabric 2.0, a full upgrade of its AI Fabric data center networking solution first introduced in 2018. The...
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