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Taiwan-based Centera Photonics, in collaboration with NewPhotonics, introduced the industry’s first 1.6 Tbps optical transceiver module featuring the NewPhotonics NPG10201 photonic integrated circuit (PIC) with a monolithically integrated laser and...

Tower Semiconductor and Alcyon Photonics have announced a strategic collaboration aimed at accelerating innovation in integrated photonics for the datacom, telecom, and optical sensing markets. Under the partnership, Alcyon Photonics...

Pilot Photonics announced the availability of its new nano Integrable Tunable Laser Assembly (nano-iTLA), targeting high-performance pluggable transceiver modules used in data center interconnect and edge networking. Built on the...

Semtech introduced its new DirectEdge™ portfolio of 100G/channel analog optical components at OFC 2025, targeting low-power Linear Pluggable Optics (LPO) for 400G and 800G AI data center networks. Designed to...

PacketLight Networks introduced the PL-8000M, a 2 x 800G muxponder platform designed for high-capacity transport in AI, cloud, and enterprise network environments. The device will be demonstrated live at OFC 2025, booth...

Sivers Semiconductors has entered a strategic OEM agreement with O-Net Technologies to develop high-performance external laser sources that will power the next wave of Co-Packaged Optics (CPO) in AI-driven data...

Ayar Labs introduced the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, the TeraPHY, aimed at enhancing AI infrastructure by delivering up to 8 Tbps bandwidth. Powered by...

MaxLinear has introduced its latest innovation in optical interconnect technology—the 1.6T Rushmore DSP and PAM4 SerDes, now sampling and commercially available. Built on Samsung’s advanced CMOS node, Rushmore supports 200G...

At OFC 2025, Keysight Technologies introduced the Keysight Artificial Intelligence (KAI) architecture, a comprehensive end-to-end testing and emulation platform for scaling AI data centers. Designed to help infrastructure providers optimize system performance at...

DustPhotonics introduced two new additions to its silicon photonics portfolio—Tamar200 and Tamar. These Photonic Integrated Circuits (PICs) support 2xFR4 optical modules and are designed for high-performance, power-efficient operation across 1.6T and 800G...

Amphenol and Semtech have jointly introduced a 1.6T OSFP Active Copper Cable (ACC) featuring Semtech’s CopperEdge 224G/lane linear equalizer/redriver ICs, optimized for low latency and power-efficient operation between adjacent racks...

POET Technologies has announced a partnership with South Korea-based Lessengers to co-develop a next-generation 800G DR8 optical transceiver targeted at AI and hyperscale data center applications. The solution will integrate...

Lumentum introduced new indium phosphide (InP) photonic chip technologies, including 400 Gbps-per-lane and 200 Gbps-per-lane optical links, along with ultra-high-power lasers for co-packaged optics. These solutions address the twin challenges...