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Alianza agreed to acquire Metaswitch from Microsoft, aiming to bolster its cloud-native and AI communications platform for service providers. Financial terms were not disclosed. This acquisition expands Alianza’s customer base...

Lumentum announced the appointment of Paul Lundstrom to its Board of Directors. The addition expands the board to nine members, eight of whom are independent. • Expertise: Lundstrom brings extensive experience...

Verizon CEO Hans Vestberg shared an ambitious vision for 2025 during the UBS Global Media & Communications Conference, with a strong focus on broadband and wireless service growth. He detailed...

Ciena has announced that Patrick H. Nettles, Ph.D., will step down as Executive Chair of its Board of Directors, transitioning toward retirement after the company’s 2025 Annual Meeting of Stockholders....

Globalstar has achieved a significant milestone with its first 5G data call on the Band n53 spectrum, delivering download speeds of 100 Mbps and upload speeds of 60 Mbps. The...

Marvell unveiled the Aquila DSP, the first coherent-lite DSP optimized for 1.6 Tbps O-band optical interconnects. Designed for data center campus connectivity spanning 2 to 20 km, the Aquila DSP...

The U.S. Department of Commerce has awarded Micron Technology up to $6.165 billion under the CHIPS Act to expand advanced memory manufacturing in Idaho and New York. This funding will...

Kioxia Corporation and Nanya Technology unveiled a jointly developed DRAM technology, OCTRAM (Oxide-Semiconductor Channel Transistor DRAM), during the IEEE International Electron Devices Meeting (IEDM) in San Francisco on December 9,...

Rambus Inc. announced a five-year extension of its comprehensive patent license agreement with Micron Technology, continuing their long-standing collaboration. The extension, which retains the existing licensing terms, grants Micron broad...

The Department of Commerce has allocated $33 million to Coherent to establish the first 150mm indium phosphide (InP) manufacturing line in Sherman, Texas. This project will modernize the company’s 65,000-square-meter...

Intel Corporation has announced the addition of two prominent figures in the semiconductor industry, Eric Meurice and Steve Sanghi, to its board of directors, effective immediately. Both will serve as...

Broadcom has announced its 3.5D eXtreme Dimension System in Package (XDSiP) platform, a new technology designed for next-generation AI accelerators (XPUs). The platform integrates over 6,000 mm² of silicon and...

Broadcom has released the first XPU based on its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology. What is this and why is it a game-changer for next-generation XPUs?...