Xscape Photonics and Tower Semiconductor introduced an on-chip, optically pumped, multi-wavelength laser platform designed for AI datacenter fabrics. The prototype, available as a validation kit, is built on Tower’s PH18...
AI clusters are hitting a wall with copper cabling, and Avicena CEO Bardia Pezeshki believes microLEDs are the way through. At this week’s IEEE Hot Interconnects online conference, he revealed...
The Optical Transport equipment market grew 14 percent year-over-year in 2Q 2025, according to a new report from Dell'Oro Group. This high growth rate was primarily attributed to the rising...
Ontario’s technology sector is getting a major boost as Ranovus announced a C$100 million (US$73 million) expansion of its optical semiconductor manufacturing facility in Ottawa. The project will create 125...
At today’s Hot Interconnects online event, Nubis Communications CTO Peter Winzer warned that AI and HPC clusters are increasingly I/O bound, with interconnect performance unable to keep pace with compute....
Spirent Communications and Telescent have formed a global strategic partnership to deliver enhanced automation for test labs and AI/ML connectivity. The agreement integrates Telescent’s optical circuit switching and automated fiber...
Xanadu and DISCO have partnered to develop advanced wafer processing techniques aimed at improving the performance and scalability of photonic integrated chips for quantum computing. The collaboration targets key manufacturing...
Nokia and MX Fiber have launched a high-capacity optical transport backbone to expand gigabit connectivity across southeastern Mexico, targeting underserved states such as Chiapas, Tabasco, and Quintana Roo, with future...
NEC Corporation has secured an order from NTT Corporation for its SpectralWave WX-T transponder, designed to convert optical and electrical signals for deployment in the IOWN APN (All-Photonics Network). The...
Corning is accelerating into its next growth phase with a clear focus on two high-value opportunities: AI-driven data center networking and next-generation Data Center Interconnect (DCI). Both markets are undergoing...
Lumentum is expanding U.S.-based manufacturing capacity for ultra-high-power (UHP) lasers used in Co-Packaged Optics (CPO) platforms, a key technology for next-generation AI data centers. The company will increase production at...
BR.Digital has upgraded its long-haul optical infrastructure using Ciena’s WaveLogic 6 Extreme (WL6e) coherent optics, enabling 1.1 Tbps single-wavelength transmission across spans exceeding 800 kilometers. The enhancement extends the lifespan...
Jerusalem-based Teramount raised $50 million in new financing to accelerate production of its fiber-to-chip optical interconnect solutions for AI, data centers, and advanced computing. Koch Disruptive Technologies (KDT) led the...
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