Intel Sells 51% of Altera to Silver Lake for $8.75B, Appoints New CEO
Intel has agreed to sell a 51% stake in its Altera business to Silver Lake in a deal that values the programmable semiconductor company at $8.75 billion. The transaction sets...
Semiconductors
Silicon solutions for data centers, network infrastructure, and CPE
NTT Unveils Low-Power AI Inference Chip for Real-Time 4K Video at the Edge
NTT Corporation has unveiled a new low-power large-scale integration (LSI) chip capable of real-time AI inference processing on ultra-high-definition (4K, 30 fps) video for edge and power-constrained devices. The LSI...
UALink 1.0 Released for Low-Latency Scale-Up AI Accelerators
The UALink Consortium officially released the UALink™ 200G 1.0 Specification, establishing an open industry standard for low-latency, high-bandwidth interconnects designed to scale AI accelerator performance in next-generation data center clusters....
IBM Unveils z17 Mainframe with On-Chip AI and Spyre Accelerator
IBM unveiled the z17 mainframe, the latest evolution of its enterprise computing platform, designed to bring AI acceleration directly into core infrastructure. Central to the system is the new IBM...
Infineon to Acquire Marvell’s Automotive Ethernet Business for $2.5B
Marvell Technology agreed to sell its Automotive Ethernet business to Infineon Technologies AG in an all-cash deal valued at $2.5 billion. The business, anchored by Marvell’s Brightlane portfolio, is projected...
STMicroelectronics and Innoscience Partner to Scale GaN
STMicroelectronics and Innoscience have signed a joint development and manufacturing agreement focused on gallium nitride (GaN) power technology, aiming to accelerate next-generation solutions for AI data centers, renewable energy, electric...
Ayar Labs Launches UCIe Optical Chiplet
Ayar Labs introduced the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet, the TeraPHY, aimed at enhancing AI infrastructure by delivering up to 8 Tbps bandwidth. Powered by...
Retym Emerges with $180M to Power Coherent DSPs
Semiconductor startup Retym has officially launched from stealth mode with over $180 million in total funding, including a newly secured $75 million Series D round led by Spark Capital. The...
Broadcom Maps Road to 200T AI Connectivity With CPO, 200G Optics
At OFC 2025, Broadcom showcased its powerful portfolio of optical and electrical interconnect solutions for AI infrastructure. The company highlighted advances across co-packaged optics (CPO), 200G/lane DSP and SerDes technologies,...
Cerebras + Ranovus = Wafer-Sale Compute + Co-Packaged Optics
Cerebras Systems has secured a new contract from DARPA to develop a next-generation real-time compute platform combining its wafer-scale engine with Ranovus’ co-packaged optics. The system is designed to deliver...
Intel CEO Lip-Bu Tan Outlines Engineering-Centric Strategy
Intel CEO Lip-Bu Tan laid out his roadmap to restore the company’s leadership in semiconductor technology and manufacturing during his keynote a company event in Las Vegas. Drawing from decades...
Broadcom Launches Sian3 and Sian2M DSP PHYs with 200 Gbps/Lane
Broadcom expanded its DSP PHY portfolio with two new products designed specifically for next-generation AI infrastructure: the Sian3 DSP PHY and the Sian2M DSP PHY. These 200G-per-lane DSPs target the...
SoftBank to Acquire Ampere Computing for $6.5B
SoftBank Group has announced it will acquire Ampere Computing, a Santa Clara-based silicon design company, in a $6.5 billion all-cash transaction. Ampere will become a wholly owned subsidiary of SoftBank...
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