ECOC24: Broadcom Launches 200G/lane DSP for 800G, 1.6T Interfaces
Broadcom announced the availability of its Sian2 DSP, a 200G per lane PAM-4 DSP PHY, designed to power the next generation of AI data centers. Sian2 supports 200G electrical and...
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Broadcom announced the availability of its Sian2 DSP, a 200G per lane PAM-4 DSP PHY, designed to power the next generation of AI data centers. Sian2 supports 200G electrical and...
SiFive, which traces its heritage back to the team that developed the RISC-V instruction set architecture (ISA) at the University of California, Berkeley, launched its latest designs aimed at high-performance...
Intel and Amazon Web Services (AWS) announced a major expansion of their long-term partnership, focusing on co-developing custom chip designs under a multi-billion-dollar, multi-year framework. Intel will produce an AI...
Intel secured up to $3 billion in direct funding under the CHIPS and Science Act to support the Secure Enclave program, which aims to enhance trusted manufacturing of advanced semiconductors...
Credo announced a new line of HiWire Active Electrical Cables (AECs) aimed at China’s growing hyperscale data centers, specifically for the 400G Q112 network port market. These new cables are...
Cerebras Systems has announced a Memorandum of Understanding (MoU) with Saudi Arabia’s Aramco to accelerate the deployment of AI across industries, universities, and enterprises in the region. The agreement focuses...
SambaNova Systems has launched SambaNova Cloud, the world’s fastest AI inference platform powered by its SN40L chip, offering unmatched performance for developers. The platform supports Meta’s popular open-source Llama 3.1...
GlobalFoundries (Nasdaq: GFS) (GF) has joined Silicon Catalyst, the only incubator and accelerator exclusively focused on semiconductor solutions, as a Strategic and In-Kind Partner. This partnership aims to accelerate the...
The U.S. Commerce Department’s Bureau of Industry and Security (BIS) has released an interim final rule (IFR) establishing new export controls on critical and emerging technologies, including quantum computing and...
Broadcom Inc. reported third-quarter revenue of $13.1 billion for fiscal year 2024, representing a 47% increase year-over-year, largely driven by the company’s semiconductor solutions and VMware contributions. Excluding VMware, revenue...
A newly formed Silicon Photonics Industry Alliance (SiPhIA), spearheaded by SEMI alongside TSMC and ASE, aims to accelerate next-generation semiconductor technologies by focusing on silicon photonics. Backed by over 30...
Credo (Nasdaq: CRDO) reported strong financial results for the first quarter of fiscal year 2025, showing significant revenue growth driven by increased demand for AI infrastructure deployments. The company achieved...
Intel introduced the Core Ultra 200V series, its most power-efficient x86 processors to date, marking a significant step in mobile AI and graphics performance. The processors are designed to offer...
© 2025 Converge Digest - A private dossier for networking and telecoms.
© 2025 Converge Digest - A private dossier for networking and telecoms.