Intel Foundry advances in DoD’s RAMP-C: Phase Three focuses on Intel 18A
Intel has been awarded Phase Three of the DoD's RAMP-C program, showcasing readiness in process technology and high-volume manufacturing with Intel 18A.
Semiconductors
Silicon solutions for data centers, network infrastructure, and CPE
Intel installs ASML’s first High Numerical Aperture EUV system
Intel Foundry has received and assembled the industry’s first High Numerical Aperture (High NA) Extreme Ultraviolet (EUV) lithography system, a next-generation lithography system developed by ASML. The ASML TWINSCAN EXE:5000...
Intel scales its neuromorphic system
By James E. Carroll, Editor Intel provided an update on its large-scale neuromorphic systems based on its human brain-inspired Loihi 2 processors. Neuromorphic computing refers to a type of computing...
Samsung to receive up to $6.4B of CHIPs Act funding for Texas fabs
Samsung Electronics is set to receive up to $6.4 billion in funding under the CHIPS Act, boosting their presence in Texas with new facilities and job opportunities.
Intel looks to Ultra Ethernet as its AI fabric
Achieving scale-up and scale-out AI systems requires an advanced networking fabric. In his keynote. Intel CEO Pat Gelsinger said he expects Ultra Ethernet to meet this requirement. Intel plans to...
TSMC to receive up to $6.6B under the CHIPS and Science Act
TSMC is to receive up to $6.6 billion in direct funding under the CHIPS and Science Act to support its investment of more than $65 billion in three greenfield leading-edge...
SK hynix to build $3.8B advanced packaging fab in Indiana
SK hynix plans to invest an estimated $3.87 billion to build a state-of-the-art advanced packaging fabrication and R&D facility for AI products in West Lafayette, Indiana. SK hynix is the...
Celestial AI raises $175M series-C for its Photonic Fabric
Celestial AI secures $175 million in Series C funding for its Optical Compute Interconnect, promising lower latency and power consumption. Exciting advancements in optical interconnect technology!
Acacia intros 800ZR and 800G ZR+ coherent pluggables
Acacia introduces 800G DSP-based pluggable modules for metro DCI upgrades, supporting QSFP-DD and OSFP form factors compliant to OIF 800ZR.
Coherent intros 100G ZR QSFP28-DCO module for outdoor deployments
Coherent Corp. unveils I-temp 100G ZR QSFP28 DCO transceiver for outdoor deployment in edge networks, offering expanded temperature range and low power consumption.
Intel to receive up to $8.5 billion under CHIPS and Science Act
The U.S. Department of Commerce proposes $8.5 billion in funding for Intel's semiconductor projects, aiming to boost American innovation in AI era.
NVIDIA Blackwell and 5th gen NVlink advance AI to trillion-parameter LLMs
NVIDIA introduces Blackwell platform, honoring mathematician David Harold Blackwell. Leveraging six new technologies for AI training and LLM inference.
Broadcom ships its 51.2 Gbps CPO switch
Broadcom unveils Bailly, the first 51.2 Tbps CPO switch for AI clusters, promising lower power consumption and higher efficiency. #BroadcomAI #CPO
A private dossier for networking and telecoms