Broadcom received conditional approval from the European Commission to complete its acquisition of VMware. The $61 billion deal was first announced on May 26, 2022. To ensure competition and innovation in cloud computingBroadcom...
Keysight Technologies introduced a Source Measure Unit (SMU) solution to speed semiconductor characterization. The new PZ2100 Series High-Channel Density Precision Source Measure Unit (SMU) Solution, simplifies channel stacking and synchronization...
The UKAEA will utilize the lab’s supercomputer based on Intel technologies, including 4th Gen Intel® Xeon Scalable processors, distributed asynchronous object storage (DAOS) and oneAPI tools to streamline the development...
Samsung Foundry disclosed plans to begin 2nm process production for mobile applications in 2025, then expand to HPC in 2026 and automotive in 2027. The company says its 2nm process...
MaxLinear's MxL1550 RF transceiver and Intel's Agilex 7 FPGA F-series device achieved 32.44 Gbps data rates during JESD204C interoperability testing. JESD204C is a multi-lane, multi-gigabit serial interface for high-throughput digital...
The Aurora supercomputer at Argonne National Laboratory, which is a collaboration of Intel, Hewlett Packard Enterprise (HPE) and the Department of Energy (DOE), reached a milestone with the installation of...
Intel released Tunnel Falls, a 12-qubit quantum chip in silicon chip for the research community. Intel also announced a collaboration with the Laboratory for Physical Sciences (LPS) at the University...
Intel selected an area near Wrocław, Poland, as the site of a new semiconductor assembly and test facility. Intel expects to invest up to $4.6 billion in the facility, which...
Keysight Technologies introduced an electronic design automation (EDA) software suite for silicon developers working on millimeter wave (mmWave) and subterahertz (sub-THz) frequency capabilities for 5G mmWave and 6G products. New...
It's been a busy year since AMD acquired Pensando for its DPUs. Soni Jiandani provides an update including deployments with Oracle Cloud, Microsoft Azure, and IBM. There's also a lot...
Broadcom has begun sampling its latest FBAR integrated front end module (FiFEM) devices for Wi-Fi access point (AP) applications, spanning Wi-Fi routers, residential gateways, and enterprise APs, enabling 5 GHz...
Apple's new flagship M2 Ultra system on a chip (SoC) is built using a second-generation 5-nanometer process and the company's "UltraFusion" silicon interposer technology to connect the die of two...
Intel announced the first implementation of its PowerVia backside power delivery technology in a product-like test chip. PowerVia solves the growing issue of interconnect bottlenecks in area scaling by moving...
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