Semiconductors

Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its total planned investment to $7 billion. The expansion adds a second greenfield...

lphawave Semi has completed the tape-out of its UCIe™ 3D chiplet IP on TSMC’s SoIC-X platform, delivering up to 10x power efficiency and 5x signal density over traditional die-to-die interfaces....

Napatech introduced the F3070X Data Processing Unit, a 400G acceleration platform powered by Altera Agilex FPGA and Intel Xeon D technology. Designed for AI, cloud, and enterprise datacenters, the new...

Corintis raised $24M in Series A funding to scale its microfluidic chip cooling technology, aiming to tackle the growing thermal bottleneck in AI datacenters. Microsoft validated the approach with a...

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has released a Broad Agency Announcement (BAA) soliciting proposals for research, prototyping, and commercial solutions to strengthen U.S....

Coherent has introduced its next-generation 2D VCSEL and photodiode arrays, targeting short-reach optical interconnects for AI-driven datacenters. Announced ahead of ECOC 2025 in Copenhagen, the new arrays are designed to...

Cadence announced a major expansion of its collaboration with TSMC to accelerate AI and HPC semiconductor design, covering advanced EDA flows, 3D-IC packaging, and high-performance IP. The partnership spans process...

Alphawave Semi announced the tapeout of its 64 Gbps UCIe Gen3 IP subsystem on TSMC’s 3nm (N3P) process, setting a new benchmark for die-to-die connectivity in chiplet-based architectures. The design...

Marvell Technology (NASDAQ: MRVL) authorized a new $5 billion stock repurchase program and launched a $1 billion accelerated share repurchase (ASR) agreement with a major financial institution. The announcement comes...

SiTime (NASDAQ: SITM) has entered the $4 billion resonator market with the launch of its new Titan Platform™, a family of MEMS resonators built on the company’s sixth-generation FujiMEMS™ technology....

OpenAI and NVIDIA unveiled plans for a massive strategic partnership centered on building at least 10 gigawatts of AI data centers powered by NVIDIA systems. The companies signed a letter...

STMicroelectronics (NYSE: STM) announced a major step forward in advanced chip packaging with plans to build a next-generation Panel-Level Packaging (PLP) pilot line at its Tours, France site. This facility,...

NVIDIA and Intel announced a sweeping collaboration to co-develop custom processors for AI infrastructure and personal computing, alongside a $5 billion NVIDIA investment in Intel common stock. The deal marks...