Semiconductors

 Fungible has appointed Eric Hayes as its new CEO and member of Fungible’s Board of Directors, succeeding Pradeep Sindhu, who has served as Executive Chairman and CEO since Fungible’s inception....

GlobalFoundries (GF) announced its expansion plans for its most advanced manufacturing facility in upstate New York.GF will invest $1 billion to immediately add an additional 150,000 wafers per year within...

Untether AI, a start-up based in Toronto, announced an oversubscribed $125 million funding round for its at-memory computation and AI inference acceleration silicon.The latest funding was led by an affiliate...

The Telecom Infra Project's Evenstar reference desing for O-RAN deployments has picked up new supply chain partners, including Baicells, Marvell, MaxLinear, and Sterlite Technologies Limited. Existing technology partners include ADI,...

Marvell introduced its new OCTEON 10 DPU for accelerating security, networking, and storage workloads required by demanding 5G, cloud, carrier and enterprise datacenter applications. The OCTEON 10 DPU is designed on...

Ethernet controller and adapter revenue grew 6 percent quarter-over-quarter in 1Q 2021 as inventory correction from the prior quarter eases, according to a new report from Dell'Oro Group. The market...

Openness was a big theme at this year's virtual #OFC21 event, with big announcements concerning XR optics, OSFP modules, 800G, disaggregated platforms based on Telecom Infra Project (TIP) designs, and...

GLOBALFOUNDRIES announced an $800 million agreement with GlobalWafers to add 300mm silicon-on-insulator (SOI) wafer manufacturing and expand existing 200mm SOI wafer production at GWC’s MEMC facility in O’Fallon, Missouri. The...

Samsung Electronics introduced its newest radio frequency (RF) technology based on 8-nanometer (nm) process.Samsung’s 8nm RF process technology is the latest addition to an already broad portfolio of RF-related solutions,...

Marvell announced its Atlas 50Gbps PAM4 DSP chipset which integrates transimpedance amplifiers (TIAs) and laser drivers in the CMOS package.The integration of the new Atlas chipset, which is based on...

Marvell has begun sampling the industry's first 1.6T Ethernet PHY with 100G PAM4 electrical input/outputs (I/Os) in 5nm, enabling next-generation 100G serial-based 400G and 800G Ethernet links for high-density switches....

Marvell announced sampling of is new Deneb ultra-low power, multi-mode 400G DSP for disaggregated optical platforms. The new 7nm CDSP for 400G pluggable, which is compatible with its predecessor (Canopus), provides...

TSMC cited progress with its "3DFabric" advanced packaging and chip stacking technologies at the company’s online 2021 Technology Symposium. TSMC will be offering larger reticle-size for both its InFO_oS and CoWoS®...