Cadence has introduced the Palladium Dynamic Power Analysis (DPA) App, enabling semiconductor and systems designers to accurately measure and optimize power usage in billion-gate AI and ML chip designs before...
The global Data Center Accelerator market is projected to reach $446 billion by 2029, according to a new report from Dell'Oro Group. Accelerators now account for roughly one third of total data...
AGY has introduced L-HDI, a new low coefficient of thermal expansion (CTE) glass fiber designed for high-density interconnect (HDI) substrates and chip packaging in advanced AI hardware. Produced at the...
President Trump announced 100% tariffs on imported semiconductors except for companies committed to building in the United States. Those companies, including Apple, will face a 0% tariff. However, if the...
Open Compute Project (OCP) has released a new Universal D2D Transaction and Link-Layer specification that broadens support to UCIe and other PHY standards, enabling greater silicon diversity in AI and...
AMD posted record revenue of $7.7 billion in the second quarter of 2025, up 32% year-over-year, driven by strong sales of EPYC server processors and Ryzen client CPUs. Net income...
Astera Labs posted record financial results for the second quarter of fiscal 2025, reporting revenue of $191.9 million, up 20% sequentially and 150% year-over-year. GAAP net income reached $51.2 million...
Broadcom has started shipping its Jericho4 Ethernet fabric router, a purpose-built platform for distributed AI and HPC infrastructure. Designed to interconnect over one million XPUs across multiple facilities, Jericho4 addresses...
Arteris announced a collaboration with AMD to integrate its FlexGen Network-on-Chip (NoC) interconnect IP into AMD’s next-generation AI chiplet designs. The agreement enables AMD to license FlexGen for use alongside...
Qualcomm reported fiscal third-quarter 2025 revenue of $10.4 billion, up 10% year-over-year, driven by record automotive revenues and continued strength in IoT. The company posted GAAP earnings per share of...
FuriosaAI secured $125 million in Series C bridge funding to accelerate production of its RNGD (“Renegade”) AI inference chip and advance development of its next-generation silicon. The Seoul-based company, founded...
Multibeam Corp. raised $31 million in an oversubscribed Series B round to accelerate development of its multi-column electron beam lithography (EBL) systems for advanced semiconductor applications. The round was led...
Positron AI, a Reno-based startup focused on inference-optimized AI hardware, secured $51.6 million in an oversubscribed Series A funding round, bringing its total capital raised this year to over $75...
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