Semiconductors

Nokia is integrating Intel’s new Xeon 6 processors with Efficient-cores (E-cores) into its core network infrastructure, delivering up to 60% power savings and a 150% performance increase over previous-generation deployments....

OKI and NTT Innovative Devices have developed a mass production process for high-power terahertz devices that could accelerate adoption of next-generation 6G communications and non-destructive sensing technologies. The breakthrough leverages...

Intel sharpens its engineering focus with a series of executive appointments aimed at boosting customer engagement and advancing AI and silicon innovation. The company named Greg Ernst as chief revenue...

Cadence has expanded its multi-year partnership with Samsung Foundry to accelerate advanced SoC, 3D-IC, and chiplet designs for AI data centers, automotive, and next-gen connectivity. The collaboration now includes an...

Synopsys and Samsung Foundry have expanded their collaboration to advance the design of next-generation AI, HPC, and multi-die systems on Samsung’s most advanced nodes, including SF2 and SF2P. The companies’...

Texas Instruments unveiled plans to invest more than $60 billion to expand its U.S. semiconductor manufacturing footprint, marking the largest investment in foundational chip production in U.S. history. The plan...

As cloud providers, AI startups, and sovereign entities scale out their data center architectures, Marvell sees increasing demand not only for primary compute engines—such as custom CPUs, GPUs, and accelerators—but...

Marvell is sharpening its focus on co-packaged optics (CPO) and advanced packaging as key enablers for next-generation AI data centers. At the company's Investor Day event, Radha Nagarajan, Marvell’s SVP and CTO of Optical...

The explosive growth of cloud computing, artificial intelligence (AI), and high-performance computing (HPC) is pushing data center networks toward unprecedented bandwidth demands. As switch capacities leap from 25.6 Tbps to...

Marvell has introduced a custom UALink scale-up solution aimed at enabling rack-scale AI infrastructure with high compute utilization, low latency, and power efficiency. The announcement expands Marvell’s custom compute platform...

TSMC and the University of Tokyo have inaugurated the “TSMC-UTokyo Lab,” marking TSMC’s first joint research facility with a university outside Taiwan. Located at UTokyo’s Asano campus, the lab will...

Marvell has introduced a production-ready, modular multi-die packaging platform that enables next-generation custom AI accelerators to scale beyond the limits of traditional monolithic silicon designs. The platform integrates a novel...

Xiaomi unveiled its first self-developed flagship chipsets—the XRING O1 3nm SoC and XRING T1 4G smartwatch SoC—during a high-profile product launch in Beijing themed “A New Beginning.” The debut marks a major...