CEVA, , a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, and Aricent have developed a licensable IP platform for LTE baseband terminals. The design, which is based on a CEVA DSP core, was shown at this week’s LTE World Summit 2009 in Berlin running several LTE physical layer functions purely in software.
CEVA’s industry leading DSP cores power many of the world’s leading cellular baseband handset solutions through its broad customer base including Infineon, ST-Ericsson, Broadcom, Spreadtrum and VIA Telecom, among others. To date, more than 450 million CEVA-powered handsets have shipped.
Addressing next generation LTE terminal and infrastructure markets, the CEVA-X1641 and CEVA-XC DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high performance WiMAX, LTE and SDR wireless communications processors. CEVA has multiple licensees today developing LTE handset and infrastructure solutions based on CEVA DSP cores.
Aricent’s modular implementation of the LTE Category 3 UE PHY provides building blocks that offer the flexibility to implement an LTE PHY using the most appropriate architecture for the target silicon. The modular format also allows replacing key processing modules (FFT, DFT, FEC, etc) with accelerators enabling power savings, while fully leveraging the processor architecture. Customers can select and optimize low-level functional modules or choose complete chains PUSCH or PRACH. The Aricent LTE PHY also offers configuration flexibility between the different channel bandwidth ranging from 1.4 to 20 MHz.
http://www.aricent.com
http://www.ceva-dsp.com
