CoolIT Systems has introduced a 4000W-ready single-phase direct liquid cooling (DLC) coldplate, more than doubling the previously accepted power limits of single-phase DLC. Designed for AI and high-performance computing (HPC) workloads, this innovation demonstrates single-phase DLC’s capability to cool ultra-high-watt processors, positioning it as a key enabler for next-generation semiconductor thermal management. The 4000W coldplate, powered by CoolIT’s Split-Flow™ technology, provides 30% better thermal and flow performance than standard coldplates, while maintaining ultra-low thermal resistance and optimized flow rates for high-wattage chips.
In testing, CoolIT’s coldplate captured over 97% of the heat from a 4000W thermal test vehicle (TTV) at a 6 liters per minute (LPM) flow rate, aligning with industry-recommended cooling requirements. Even at lower flow rates, the system maintained excellent performance, achieving a thermal resistance of Tr<0.009 C/W while keeping the full flow loop pressure drop below 8 PSI. With single-phase DLC already the most widely deployed liquid cooling technology for AI processors exceeding 1000W TDP, these results reinforce CoolIT’s leadership in scalable and reliable cooling solutions for next-gen AI and HPC infrastructure.
• 4000W-ready single-phase DLC coldplate sets a new benchmark for AI and HPC cooling.
• Captures 97%+ of heat at industry-standard flow rates, supporting ultra-high-power processors.
• Achieves ultra-low thermal resistance of Tr<0.009 C/W, maintaining full system efficiency.
• Split-Flow™ technology improves thermal and flow performance by 30% over standard coldplates.
• Deployed by major server manufacturers, enabling scalable cooling for multiple server generations.
“CoolIT continues to lead the industry in performance. We are thrilled to show silicon leaders that single-phase DLC will continue to be a key enabling technology with demonstrated capability for up to 4000W processors,” said Kamal Mostafavi, VP of Engineering at CoolIT Systems.
