Corning introduced EXTREME ULE Glass, a new material designed to meet the increasing demands of chipmakers working with extreme ultraviolet (EUV) lithography. This next-generation glass, engineered for high numerical aperture (High NA) EUV lithography, enhances the performance of photomasks, critical tools in producing advanced microchips. As semiconductor manufacturers push for greater precision in chip designs, Corning’s latest innovation aims to support this trend by delivering improved thermal stability and manufacturing consistency.
EXTREME ULE Glass builds on Corning’s existing Ultra-Low Expansion (ULE) glass portfolio, which is already used in EUV photomasks and lithography mirrors. The new glass material offers significant improvements in flatness and uniformity, reducing photomask waviness and limiting variability in the chip production process. Corning expects this innovation to help chipmakers increase yields while meeting the challenges posed by AI-driven technologies and shrinking chip geometries.
• Supports high numerical aperture (High NA) EUV lithography
• Designed for advanced photomasks used in chip manufacturing
• Reduces photomask waviness and variability
• Delivers consistent thermal stability for extreme conditions
• Builds on Corning’s ULE® glass portfolio for EUV technology
• Contributes to sustainability by reducing energy use and waste
“As the demands of integrated chipmaking grow with the rise of artificial intelligence, glass innovation is more important than ever,” said Claude Echahamian, Vice President & General Manager, Corning Advanced Optics. “EXTREME ULE Glass will expand Corning’s vital role in the ongoing pursuit of Moore’s Law by helping enable higher-powered EUV manufacturing as well as higher yield.”
