DustPhotonics introduced a single-chip 800G PIC (Photonic Integrated Circuit) for DR8 and DR8+ applications, providing 8 optical channels independently modulated at 100Gb/s for an aggregate bandwidth of 800Gb/s.
The chip is designed into a compact 7.5mm x 7mm package, enabling it to be used in industry standard QSFP and OSFP style form factors. The PIC includes on-chip lasers, incorporating DustPhotonics’ patented L3C (low-loss laser coupling) technology, whereby off-the-shelf lasers from a variety of different manufacturers can be integrated with the PIC.
The device is suitable for reaches up to 2km in applications including hyperscale data centers and AI and Machine-Learning clusters.
At ECOC,, DustPhotonics is demonstrating this device in multiple configurations including a traditional 800GBASE-DR8 application, an immersion cooling application, and a reduced reach application. The immersion cooling demo showcases how this chip is suited to be immersed in a liquid coolant, since there is no free-space interface between the laser and PIC or at the fiber attach interface at the optical output of the chip.
For the reduced reach application, DustPhotonics is demonstrating a second, cost optimized version of the product suitable for transceivers or AOCs (Active Optical Cables) up to 100m, or for LPO (linear-drive pluggable optic) applications.
“We are seeing a lot of customer traction for this 800G application, and we are excited to showcase the broad range of applications that we support,” said Ronnen Lovinger, CEO of DustPhotonics. “We are well-positioned for the next phase of the company which is to scale into high-volume manufacturing.”
The device is sampling to customers today and is expected to be in production by the first quarter of 2024.
