• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 10, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » ECOC 2018: DSFP form factor doubles data rate and density of SFP

ECOC 2018: DSFP form factor doubles data rate and density of SFP

September 25, 2018
in All
A A

A rev 1.0 hardware specification has been released for new DSFP (Dual Small Form-Factor Pluggable) modules — doubling the data rate and port density of SFP modules in the same footprint.

Whereas SFP has a single electrical lane pair operating at bit and data rates up to 28 Gbps using NRZ and 56 Gbps using PAM4, the new DSFP has two electrical lane pairs, each operating at bit rates up to 26 Gbps using NRZ and 56 Gbps using PAM4, supporting aggregate date rates up to 56 Gbps and 112 Gbps, respectively. DSFP will potentially scale to a per lane bit rate of 112 Gbps using PAM4, supporting aggregate data rate up to 224 Gbps. SFP modules can be plugged into DSFP ports for backwards compatibility.

The spec was developed by the DSFP MSA (Multi-Source Agreement) Group, whose founding members are Amphenol, Finisar, Huawei, Lumentum, Molex, NEC, TE Connectivity, and Yamaichi.

The DSFP Hardware Specification Rev. 1.0 includes complete electrical, mechanical and thermal specifications for module and host card, including connector, cage, power, and hardware I/O. Also included are operating parameters, data rates, protocols, and supported applications.

Work is now underway on the DSFP MIS (Management Interface Specification), which is an abridged version of the CMIS (Common MIS) being developed by the QSFP-DD, OSFP and COBO Advisors Group.

“We are very excited about the introduction of a highly competitive new form factor by the DSFP MSA, which will double interface bandwidth and port density while maintaining compatibility with the existing SFP family of optics,” said Zhoujian Li, President of Research and Development, Wireless Networks, Huawei. “The DSFP form factor is low cost, has excellent high-speed signal integrity, reduces PCB area and is easy to design and manufacture.  It is a great platform that enables 5G deployment and evolution, while fully protecting our customers’ investment.”

“Publication of the DSFP Hardware Specification is part of an industry trend of quickly developing solutions optimized for specific applications. Stringent cost, power and size constraints in demanding market segments, like Mobile infrastructure, leads to solutions focused strictly on required functionality,” commented Chris Cole, Chair of the DSFP MSA Group, and Vice President of Advanced Development, Finisar.

http://www.dsfpmsa.org

Tags: Blueprint columnsDSFPECOCStandards
ShareTweetShare
Previous Post

ECOC 2018: Finisar debuts 400G QSFP-DD DR4 transceiver

Next Post

ECOC 2018: MaxLinear intros 400 Gbps DR4 Optical Modules, 100G transceiver/driver

Staff

Staff

Related Posts

Blueprint: Brazil looks to municipal Wi-Fi 6E
Blueprints

Blueprint: Brazil looks to municipal Wi-Fi 6E

February 21, 2023
Blueprint: Building wholesale networks with OTN
All

Blueprint: Building wholesale networks with OTN

December 20, 2022
Oracle opens cloud region in Chicago
All

Oracle opens cloud region in Chicago

December 20, 2022
BT trials C-RAN in Leeds
All

BT trials C-RAN in Leeds

December 19, 2022
T-Mobile builds cloud native 5G converged core with Cisco
All

T-Mobile builds cloud native 5G converged core with Cisco

December 15, 2022
Meta halts data center expansion construction in Denmark
All

Meta halts data center expansion construction in Denmark

December 15, 2022
Next Post
ECOC 2018: MaxLinear intros 400 Gbps DR4 Optical Modules, 100G transceiver/driver

ECOC 2018: MaxLinear intros 400 Gbps DR4 Optical Modules, 100G transceiver/driver

Please login to join discussion

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version