At ECOC 2024 in Frankfurt, Avicena unveiled a major advancement in its LightBundle technology, extending the reach of its microLED-based optical interconnects to 30 meters, tripling the previous demonstration of 10 meters. Avicena’s LightBundle interconnects now span a full row of data center racks, offering superior performance compared to conventional electrical and laser-based links, which are limited by cost, reliability, and range.
Avicena’s LightBundle interconnects use arrays of microLEDs connected via multi-core fiber bundles to Si Detectors on CMOS ICs.
Avicena says its LightBundle technology fills a critical gap by delivering an energy-efficient and cost-effective solution for interconnects over longer distances. The company’s latest 30-meter demonstration signals future potential for even longer reaches, with the possibility of extending to 100 meters through further optimization. Additionally, Avicena’s technology benefits from relaxed alignment tolerances, making manufacturing and packaging simpler and more reliable compared to traditional optical interconnects.
Avicena’s advancements will be demonstrated live at ECOC 2024, emphasizing the versatility and scalability of microLED-based optical links in data centers and beyond, including automotive applications where longer interconnects are needed.
• Product: LightBundle microLED-based optical interconnects
• New feature: Extended 30-meter reach
• Benefits: Higher bandwidth density, energy efficiency, reliability, and cost-effectiveness
• Applications: Data center racks, AI clusters, HPC, automotive interconnects
• Future potential: Reaches of 100 meters with further optimization
• Demonstration: ECOC 2024, Frankfurt, Germany
“At 30 meters these interconnects can easily cover a row of racks in a datacenter or the full length of a commercial vehicle like a bus in automotive applications,” said Bardia Pezeshki, Founder and CEO of Avicena.
