Broadcom announced the availability of its Sian2 DSP, a 200G per lane PAM-4 DSP PHY, designed to power the next generation of AI data centers. Sian2 supports 200G electrical and optical interfaces for scaling up AI clusters as demand for higher performance and larger cluster sizes continues to surge.
With the migration from 400G/800G links to 800G/1.6T optical links supported by Broadcom’s 200G/lane optics, the Sian2 DSP positions itself as a key enabler for scaling AI clusters efficiently. The platform is optimized for data center environments, offering performance and cost savings while delivering the bandwidth required for next-gen AI deployments.
Broadcom’s Sian2 DSP will be featured in a live demo at ECOC 2024, showcasing its 1.6T optical module solutions. AI market leaders are expected to begin adopting these modules in 2025, with demand projected to surpass 1 million units within the first year.
• Product: Sian2 DSP PHY (200G per lane)
• Applications: AI data centers, 800G and 1.6T optical transceivers
• Features: 5nm DSP, sub-28W power consumption for 1.6T transceivers
• Latency: Sub-80ns roundtrip latency for AI/ML
• Key support: InfiniBand and Ethernet, multiple FEC options, 200G SerDes interfaces
• Demo: ECOC 2024, Frankfurt, Booths B81 and D60
“200G/lane DSP is foundational to high-speed optical links for next generation scale-up and scale-out networks in the AI infrastructure,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “The Sian family of products reinforces Broadcom’s leadership in optical DSP PHYs and enables our AI data center customers to deploy high-performance 800G and 1.6T links.”
