Jabil Inc. has announced the expansion of its silicon photonics capabilities at its Ottawa, Canada site to support the growing demands of AI and next-generation data center technologies. The expansion, set for the fourth quarter of 2024, will enable faster scaling of new photonics product introductions (NPIs), offering advanced packaging techniques such as fluxless flip-chip, fiber attachment, and wire bonding. This development is aimed at enhancing performance and reliability for hyperscalers and cloud customers, particularly in high-speed connectivity applications like co-packaged optics (CPO) and high-speed on-board connections. Jabil’s continued investments in silicon photonics, including work on 800G and 1.6T technologies, underscore its focus on supporting the scalability and efficiency of modern data centers.
• Expansion site: Ottawa, Canada
• Focus: Silicon photonics packaging, NPIs for hyperscalers and AI data centers
• Key technologies: Fluxless flip-chip, fiber attachment, wire bonding, precise die bonding
• Applications: Co-packaged optics (CPO), high-speed connectivity, 800G and 1.6T technologies
• Showcase: Live demos of 800G LPO/LRO transceivers and 1.6T module at ECOC 2024, Booth B101
“The expansion of our Ottawa site is a game-changer for Jabil. This facility will enable us to meet the growing demands for advanced photonics solutions tailored to AI and next-generation data centers. Through our NPI capabilities, we can assist customers in their own product development journeys, significantly reducing the need for costly trial and error in developing their own solutions from scratch,” said Matt Crowley, Executive Vice President, Global Business Units.
