NewPhotonics Ltd. introduced its NPG102 PIC transmitter-on-chip (TOC), designed for 1.6 Tbps DSP-based optical transceiver modules, aimed at supporting AI-driven data center infrastructure demands. The NPG102 TOC offers low-latency data communication with minimal power consumption, making it suitable for handling high-volume data traffic in AI clusters. It integrates octal channel auto-tunable lasers and 224 Gbps PAM4 modulation, achieving 1.6 Tbps of aggregated bandwidth for efficient electrical-to-optical transmission.
The NPG102 TOC is optimized for pluggable OSFP modules and features monolithically integrated lasers and modulators, which enable enhanced system integration. This design approach accelerates OEM manufacturing by streamlining wafer-level laser alignment and improving yield maturity. With internal ADC/DAC support for channel control and monitoring, the transmitter consumes just 2.9 W while offering on-chip temperature monitoring, contributing to efficient power usage.
Doron Tal, senior vice president and general manager of Optical Connectivity at NewPhotonics, emphasized the critical need for advanced solutions in data centers. “Our all-optics innovation roadmap for the NPG102 for 1.6 Tbps DSP-based modules puts data centers on a path in this decade to deliver higher capacity, low-power optical connectivity.” The NPG102 PIC will be available for sampling in Q2 2025.
• NewPhotonics introduces NPG102 PIC transmitter-on-chip for 1.6 Tbps DSP-based modules.
• Features integrated octal channel lasers, 224 Gbps PAM4 modulation, and on-chip temperature monitoring.
• Designed for OSFP modules with low power consumption of 2.9 W.
• Sampling availability set for Q2 2025.
“Our all-optics innovation roadmap for the NPG102 for 1.6 Tbps DSP-based modules puts data centers on a path in this decade to deliver higher capacity, low power optical connectivity,” said Doron Tal, senior vice president at NewPhotonics.
