SENKO Advanced Components and GlobalFoundries (GF) unveiled a wafer-level detachable fiber connector system at ECOC 2025 that directly addresses a critical challenge in scaling Co-Packaged Optics (CPO) for AI and cloud data centers. The solution enables precise, repeatable alignment for photonic integrated circuits (PICs), while introducing a method for efficient testing at every stage of high-volume production.
The joint innovation begins with GF’s etched trench design for photonic chips, enabling broadband spot size converters (SSCs) that withstand the high-power lasers needed in CPO architectures. SENKO’s approach embeds microlenses in these trenches and bonds a SEAT receptacle directly onto the die, establishing a mechanically robust and optically stable coupling point. The detachable receptacle allows for passive, repeatable alignment and is optimized for high-volume manufacturing in GF’s New York fabs.
SENKO’s Metallic PIC Coupler (MPC) mates with the receptacle to deliver consistent coupling and a detachable interface. This modularity supports wafer- and die-level testing, simplifies assembly integration, and ensures reliable connectivity in high-radix, high–data rate CPO switches. Both companies emphasized that this step marks a path toward mass adoption of co-packaged optics in scale-up and scale-out network architectures.
- GF etched trench with integrated SSCs supports broadband coupling and high-power lasers
- Microlens and SEAT receptacle bonding enables passive, repeatable optical alignment
- SENKO’s Metallic PIC Coupler provides detachable, precise fiber-to-chip connectivity
- Wafer- and die-level testing integrated into manufacturing flow
- Designed for high-radix scalability and next-generation CPO switches
“This is a game-changer,” said Kazu Takano, Chief Business Development Officer and President of the SENKO Emerging Technologies Group. “By enabling precise, repeatable alignment and seamless integration from wafer to system, we are opening the door to scalable manufacturing and unlocking the performance needed for the next generation of data infrastructure.”
🌐 Analysis: This development directly addresses one of the biggest hurdles for co-packaged optics—manufacturing readiness at scale. By combining SENKO’s detachable coupling technology with GF’s silicon photonics platform and advanced manufacturing, the partnership positions itself against efforts by Intel, Broadcom, and Ayar Labs to commercialize CPO interconnects. As AI datacenter workloads drive higher-radix switching requirements, advances in testability and serviceability will be critical differentiators.
🌐 We’re tracking the latest developments at ECOC25 in Copenhagen. Follow our ongoing coverage at https://convergedigest.com/tag/ecoc25/
