Equinix is expanding its support for advanced liquid cooling technologies to over 100 of its data centers worldwide. This will enable businesses to use the most efficient cooling methods for high-density hardware used in compute-intensive workloads such as artificial intelligence (AI).
Direct-to-chip liquid cooling, a unique approach that involves cooling the chip directly, will be available in over 45 metros, including major tech hubs like London, Silicon Valley, and Singapore.
Equinix said its vendor-neutral approach allows customers to choose their preferred hardware provider, ensuring a flexible and efficient data center experience. Equinix supports major liquid cooling technologies, including direct-to-chip and rear-door heat exchangers so that customers can take advantage of the most efficient solutions.
“Liquid cooling is revolutionizing how data centers cool powerful, high-density hardware that supports emerging technologies, and Equinix is at the heart of that innovation,” said Tiffany Osias, Vice President of Global Colocation, Equinix. “We have been helping businesses with significant liquid-cooled deployments across a range of deployment sizes and densities for years. Equinix has the experience and expertise to help organizations innovate data center capacity to support the complex, modern IT deployments that applications like AI require.”
