Fujitsu Microelectronics America announced a new mobile WiMAX chipset optimized for small, embedded modules targeting mobile WiMAX devices such as smart phones and PDAs. Samples will be delivered to major module manufacturers starting in August 2008.
The chipset includes a baseband IC, the MB86K22; an RF IC, the MB86K52; and a power management IC, the MB39C316. The three devices are essential elements for competitive WiMAX modules. The chipset was designed so that the size of the WiMAX module will be 12x12mm. The idle current, which has a direct impact on battery life, will not exceed 0.5mA, helping the development of attractive mobile WiMAX terminals.http://us.fujitsu.com/micro/WiMAX
