GE’s Global Research Center is developing an advanced thermal substrate with better heat dissipation properties than copper.
The development of GE’s prototype substrate, which utilizes phase-change-based heat transfer, is part of a four year, $6 million program funded by the Defense Advanced Research Program Agency (DARPA).
Dr. Tao Deng, a senior scientist at GE Global Research and the project leader, said, “As electronics become more advanced, we are approaching the point where conventional materials like copper can’t take the heat. For computing to go faster and electronics systems to become more capable, better cooling solutions such as GE’s prototype substrate will be required to allow this to happen.”
GE said its phase-change based prototype substrate can be applied to computer chips and a variety of different electronic components. It acts as a cooling mechanism that spreads or dissipates the heat generated in electronic systems to keep components cool. Tests have shown at least twice the thermal conductivity as copper at only one–fourth of its weight. In addition, the prototype successfully operated in a condition that was more than 10 times normal gravity.
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