GlobalFoundries plans to establish the New York Advanced Packaging and Photonics Center at its Malta, New York, manufacturing facility. This first-of-its-kind center, supported by investments from New York State and the U.S. Department of Commerce, will focus on advanced packaging and testing for U.S.-made semiconductors used in critical industries such as AI, automotive, aerospace, defense, and communications. The initiative addresses the growing demand for silicon photonics and 3D/heterogeneously integrated (HI) chips, aiming to create a secure, end-to-end domestic semiconductor supply chain.
The center will deliver advanced packaging, bump, assembly, and testing capabilities for GF’s differentiated silicon photonics platform, which integrates optical and electrical components on a single chip. It will also provide turnkey packaging and testing for chips used in national security applications under GF’s Trusted Foundry accreditation, ensuring that sensitive devices remain entirely within the U.S. production pipeline. Additionally, it will support advanced packaging processes for 3D and HI chips using GF’s leading platforms, including 12LP+ and 22FDX®. These capabilities aim to position GF as a leader in semiconductor innovation and support geodiversity in supply chains for global customers.
With an expected investment of $575 million and an additional $186 million dedicated to research and development over the next decade, the center is projected to create approximately 100 new jobs at GF’s Malta facility, which already employs 2,500 people. The U.S. Department of Commerce will contribute up to $75 million in direct funding, supplemented by $20 million from New York State. This investment builds on the state’s prior $550 million support for GF under the Green CHIPS program.
• Key Features of the New York Advanced Packaging and Photonics Center:
• Silicon Photonics Platform: Advanced packaging and testing to combine optical and electrical components for enhanced power efficiency and performance.
• Trusted Foundry Accreditation: Secure production for aerospace and defense applications, ensuring chips remain in the U.S. throughout manufacturing.
• 3D/HI Chip Capabilities: Wafer-to-wafer bonding and assembly for leading GF platforms, such as 12LP+ and 22FDX®.
• Investment Breakdown: $575M for development and $186M for R&D over 10+ years.
“We’re proud to partner at the state and federal level on this new center, which is a direct response to our customers asking for more geodiversity in their supply chains and additional support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings,” said Dr. Thomas Caulfield, President and CEO of GF.
