• Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
Friday, April 10, 2026
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io
No Result
View All Result
Converge Digest
No Result
View All Result

Home » GlobalWafers Lands $406M CHIPS Act Funding for U.S. Wafer Plants

GlobalWafers Lands $406M CHIPS Act Funding for U.S. Wafer Plants

December 17, 2024
in Semiconductors
A A

The U.S. Department of Commerce finalized an award of up to $406 million in CHIPS Act funding to GlobalWafers America, LLC (GWA) and MEMC LLC, subsidiaries of Taiwan-based GlobalWafers Co., Ltd. These funds, issued through the CHIPS Incentives Program, will support the development of advanced silicon wafer manufacturing facilities in Texas and Missouri. With a combined investment of nearly $4 billion, these projects aim to establish the first domestic production source of 300mm silicon wafers for advanced semiconductor chips and expand the production of silicon-on-insulator (SOI) wafers. The funding will be disbursed upon achieving construction and production milestones.

The GWA facility in Sherman, Texas, will focus on high-volume production of 300mm silicon wafers for advanced semiconductor devices, including memory chips. In O’Fallon, Missouri, the MEMC facility will produce SOI wafers, crucial for defense and aerospace applications. The projects are expected to generate approximately 1,700 construction jobs and 880 manufacturing roles across both locations. As part of the initiative, GlobalWafers also plans to convert a portion of its Texas facility for the production of silicon carbide epitaxy wafers, vital for electric vehicles and clean energy technologies.

These investments aim to address the semiconductor industry’s reliance on foreign wafer production while strengthening U.S. supply chains and national security. “The semiconductor wafers produced here will be the foundation for advanced chips that allow us to out-innovate and out-compete globally,” said Secretary of Commerce Gina Raimondo. Doris Hsu, Chairperson and CEO of GlobalWafers, expressed gratitude for the partnership, stating, “Through these investments, we look forward to innovating with U.S.-based chip customers for decades to come.”

Key Points

• Funding: $406 million in CHIPS Act funding from the U.S. Department of Commerce.

• Investment: Nearly $4 billion in total capital expenditure.

• Locations: Sherman, Texas (300mm silicon wafers) and O’Fallon, Missouri (SOI wafers).

• Job Creation: ~1,700 construction jobs and 880 manufacturing jobs.

• Silicon Carbide: Conversion of part of the Texas facility for silicon carbide wafer production.

• Impact: Addresses reliance on foreign wafer production and strengthens domestic supply chains.

Tags: CHIPs Act
ShareTweetShare
Previous Post

Eutelsat Taps Airbus to Build Next-Generation OneWeb Satellites

Next Post

Ariane Schaffer Elected Chair of Fiber Broadband Association’s 2025 Board

Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

Related Posts

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics
Semiconductors

NIST Issues Broad Agency Announcement to Advance U.S. Microelectronics

September 25, 2025
Natcast Leads U.S. National Semiconductor Technology Center with $6.3B Funding
Semiconductors

Natcast Leads U.S. National Semiconductor Technology Center with $6.3B Funding

January 16, 2025
U.S. advances plan for national semiconductor research facilities
Semiconductors

U.S. Department of Commerce Allocates $1.4 Billion for Advanced Semiconductor Packaging

January 16, 2025
CHIPS for America allocates $3 billion for National Advanced Packaging
Semiconductors

Four More Companies Land $264M in CHIPs Act Funding

January 16, 2025
MACOM posts revenue of $178.1 million, up 14.8% yoy
Semiconductors

MACOM Unveils $345M Plan to Modernize Semiconductor Facilities

January 14, 2025
U.S. advances plan for national semiconductor research facilities
All

Amkor Secures $407M CHIPS Grant for Advanced Packaging

December 26, 2024
Next Post
Fiber Broadband Association study highlights societal impact

Ariane Schaffer Elected Chair of Fiber Broadband Association’s 2025 Board

Categories

  • 5G / 6G / Wi-Fi
  • AI Infrastructure
  • All
  • Automotive Networking
  • Blueprints
  • Clouds and Carriers
  • Data Centers
  • Enterprise
  • Explainer
  • Feature
  • Financials
  • Last Mile / Middle Mile
  • Legal / Regulatory
  • Optical
  • Quantum
  • Research
  • Security
  • Semiconductors
  • Space
  • Start-ups
  • Subsea
  • Sustainability
  • Video
  • Webinars

Archives

Tags

5G All AT&T Australia AWS Blueprint columns BroadbandWireless Broadcom China Ciena Cisco Data Centers Dell'Oro Ericsson FCC Financial Financials Huawei Infinera Intel Japan Juniper Last Mile Last Mille LTE Mergers and Acquisitions Mobile NFV Nokia Optical Packet Systems PacketVoice People Regulatory Satellite SDN Service Providers Silicon Silicon Valley StandardsWatch Storage TTP UK Verizon Wi-Fi
Converge Digest

A private dossier for networking and telecoms

Follow Us

  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

No Result
View All Result
  • Home
  • Events Calendar
  • Blueprint Guidelines
  • Privacy Policy
  • Subscribe to Daily Newsletter
  • NextGenInfra.io

© 2025 Converge Digest - A private dossier for networking and telecoms.

This website uses cookies. By continuing to use this website you are giving consent to cookies being used. Visit our Privacy and Cookie Policy.
Go to mobile version