Rapidus CEO Atsuyoshi Koike outlined Japan’s accelerated push into next-generation semiconductor manufacturing during his keynote at Hot Chips 2025 at Stanford University on August 26. Speaking on his birthday, Koike described Rapidus’ founding in 2022 and its mission to restore Japan’s position in the global semiconductor industry by leveraging domestic manufacturing expertise and international collaboration.
Koike emphasized speed as Rapidus’ differentiator. The company’s IIM-1 fab in Chitose, Hokkaido broke ground in September 2023 and reached key milestones in record time: the arrival of its first EUV lithography system in December 2024, first exposure tests in April 2025, first wafer lot in June, and successful 2nm GAA transistor results by July 10, just 12 days after the first lot introduction. Rapidus is targeting mass production in 2027 with plans to scale to 25,000 wafers per month.
Rapidus is also pursuing innovations in design and manufacturing co-optimization. The company is advancing an “all single wafer” process to accelerate data feedback, AI-driven optimization, and yield learning. A novel “grid transfer system,” inspired by warehouse automation, is being introduced to reduce wafer handling bottlenecks. Koike also highlighted collaborations with IBM and Keysight, positioning Rapidus within a broader ecosystem that includes IP, EDA, OSAT, and materials partners.
• Rapidus founded August 2022; strategic partnership with IBM signed December 2022
• IIM-1 fab ground-breaking: September 2023; EUV system arrival: December 2024
• First EUV exposure test: April 2025; first lot introduction: June 16, 2025
• Successful 2nm GAA transistor characteristics achieved: July 10, 2025
• Differentiators: rapid time-to-results, “all single wafer” processing, AI design-manufacturing co-optimization, grid transfer system
• Mass production scheduled for 2027; scaling toward 25,000 wafers/month
“We can shape a future that is not only smarter, but more human,” said Koike, closing with images from Rapidus’ third anniversary celebration atop its IIM-1 fab.
🌐 Analysis: Rapidus’ progress highlights Japan’s re-entry into advanced logic manufacturing, with speed as its defining characteristic. Achieving 2nm test wafer results just three years after its founding underscores the urgency of Japan’s strategy. The co-optimization of design and manufacturing, combined with its grid transfer and single wafer concepts, sets Rapidus apart from traditional foundry models. With TSMC and Samsung already ramping 2nm, Rapidus’ success depends on sustaining this accelerated cadence and deepening its global partnerships.
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