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Home » Hot Companies Presenting at Hot Chips 2024

Hot Companies Presenting at Hot Chips 2024

August 25, 2024
in All, Semiconductors
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Here is a list of companies presenting at Hot Chips 2024, along with their presentation topics and the names of the presenters, organized alphabetically:


1. AMD


• Topic: AMD Instinct MI300X Generative AI Accelerator and Platform Architecture


• Presenter: Alan Smith & Vamsi Krishna Alla


• Topic: AMD Versal AI Edge Series Gen 2 for Vision and Automotive


• Presenter: Tomai Knopp & Jeffrey Chu


• Topic: AMD Next Generation “Zen 5” Core


• Presenter: Brad Cohen & Mahesh Subramony


• Keynote: The Journey to Life with AI Pervasiveness


• Presenter: Victor Peng


2. Ampere Computing


• Topic: AmpereOne: Sustainable Computing for AI & Cloud Native Workloads


• Presenter: Matthew Erler


3. Broadcom


• Topic: An AI Compute ASIC with Optical Attach to Enable Next Generation Scale-up Architectures


• Presenter: Manish Mehta


4. Cerebras


• Topic: Wafer-Scale AI: Enabling Unprecedented AI Compute Performance


• Presenter: Sean Lie


5. Chinese Academy of Sciences


• Topic: XiangShan: An Open-Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards


• Presenter: Kaifan Wang


6. Enfabrica


• Topic: ACF-S: An 8-Tbit/s SuperNIC for High-Performance Data Movement in AI & Accelerated Compute Networks


• Presenter: Shrijeet Mukherjee & Thomas Norrie


7. FuriosaAI


• Topic: FuriosaAI RNGD: A Tensor Contraction Processor for Sustainable AI Computing


• Presenter: June Paik


8. IBM


• Topic: IBM Telum II processor and IBM Spyre Accelerator chip for AI


• Presenter: Chris Berry


9. Intel


• Topic: Lunar Lake: Powering the Next Generation of AI PCs


• Presenter: Arik Gihon


• Topic: Built for the Edge: The next generation Intel Xeon 6 SoC


• Presenter: Praveen Mosur


• Topic: Intel Gaudi 3 AI Accelerator: Architected for Gen AI Training and Inference


• Presenter: Roman Kaplan


• Topic: 4 Tbit/s Optical Compute Interconnect Chiplet for XPU-to-XPU Connectivity


• Presenter: Saeed Fathololoumi


10. Meta


• Topic: Next Gen MTIA – Meta’s Recommendation Inference Accelerator


• Presenter: Mahesh Maddury & Pankaj Kansal


11. Microsoft


• Topic: Inside MAIA 100


• Presenter: Sherry Xu & Chandru Ramakrishnan


12. NVIDIA


• Topic: NVIDIA Blackwell Platform: Advancing Generative AI and Accelerated Computing


• Presenter: Ajay Tirumala & Raymond Wong


• Topic: Next-generation cooling for NVIDIA’s Accelerated Computing


• Presenter: Ali Heydari


13. Preferred Networks


• Topic: MN-Core 2: Second-generation processor of MN-Core architecture for AI and general-purpose HPC applications


• Presenter: Jun Makino


14. Qualcomm


• Topic: Snapdragon X Elite Qualcomm Oryon CPU: Design & Architecture Overview


• Presenter: Gerard Williams


15. SambaNova


• Topic: SambaNova SN40L RDU: Breaking the Barrier of Trillion+ Parameter Scale Gen AI Computing


• Presenter: Raghu Prabhakar


16. SK Hynix


• Topic: SK Hynix AI-Specific Computing Memory Solution: From AiM device to Heterogeneous AiMX-xPU System for Comprehensive LLM Inference


• Presenter: Guhyun Kim


17. Stanford


• Topic: Onyx: A Programmable Accelerator for Sparse Tensor Algebra


• Presenter: Kalhan Koul


18. Tesla


• Topic: DOJO: An Exa-Scale Lossy AI Network using the Tesla Transport Protocol over Ethernet (TTPoE)


• Presenter: Eric Quinnell


19. Tenstorrent


• Topic: Blackhole and TT-Metalium – The Standalone AI Computer and its Programming Model


• Presenter: Jasmina Vasiljevic & Davor Capalija


Conference Info is posted here: https://hotchips.org/

Tags: Hot ChipsStanford
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Jim Carroll

Jim Carroll

Editor and Publisher, Converge! Network Digest, Optical Networks Daily - Covering the full stack of network convergence from Silicon Valley

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